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 Expert  108191

Expert in Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis

Available for your Consulting and Expert Witness Needs

Maryland (MD)
Education Work History Career AccomplishmentsPublicationsConsulting Services Expert Witness

Summary of Expertise: Listed with other top experts in: 
Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use environments. The report for this project is the first document of its kind to incorporate reliability issues directly into microelectronic packaging design and qualification. He has also demonstrated the applicability of the physics-of-failure approach on NASA's ZENO Space Shuttle Experiment, resulting in a new approach to reliability assessment.

electronic device reliability


integrated-circuit reliability

Expert initiated a program for the development of a standardized methodology of product development, laying emphasis on microelectronic device reliability. The courses he teaches on microelectronic device reliability are attended by many companies in the field of electronics. The concepts learned in Expert's courses have proven to achieve significant improvements in the reliability of microelectronic products.

microelectronic device reliability improvement

Expert has applied his expertise in electronics reliability to develop physics-of-failure based test methodologies for qualification and quality conformance testing of microelectronic devices and packages. Based on his work, NASA now requires that a justification be provided for electronics reliability test methodologies to show that they are relevant and do not induce harm to the product.

electronics reliability testing

Over the course of his career, Expert has modeled solder joint fatigue damage for surface mount and plated-through hole components. He has analyzed the inelastic strain history in solder fatigue specimens (designed by NASA and UNISYS engineers) for comparing the low-cycle fatigue properties of different solder compositions under thermal cycling. The models were then implemented into the CALCE software and are now used by General Dynamics and Rockwell International for estimating PCB solder life under combined thermal and vibration conditions and by Litton for estimating the reliability of plated-through holes and vias.

printed-wiring board reliability

Expert developed the Computer Aided Life Cycle Engineering (CALCE) and the Computer Aided Design of Microelectronic Packages (CADMP 2) software products. CADMP 2 is a set of integrated software programs used for modeling, simulation, and assessment of integrated circuits, hybrids, and multichip modules. CALCE is a set of integrated software programs used for the modeling, simulation, and assessment of printed wiring board assemblies. These two software tools have been used by a number of electronics companies, some of which are members of the CALCE EPRC consortium, to model, simulate, and assess package reliability.

He developed the first Reliability and Maintainability Computer Aided Design (RAMCAD) methodology as part of the Office of the Secretary of Defense program, the Institute for Defense Analyses RAMCAD program, and the Lockheed-Georgia RAMCAD program. As an indicator of his success, his research papers led to the development of RAMCAD software by more than 10 commercial companies.


semiconductor device package modeling and simulation

Expert's expertise in electronics packaging comes from his unique background that combines strategic planning, research, education, management, and technology transfer. Besides founding two companies, he created a national center for research into electronic packaging as part of the Expert's University. This center (CALCE Electronic Packaging Research Center) is funded by over 28 companies and government agencies, all interested in the design and development of cost-effective and reliable electronics products. Expert can provide insight into future plans for competing in the global market (including involvement in the military-government market) and how clients should plan to compete (or unite) with the Asian and European communities. He can advise clients on their current and planned methods for design and development, manufacturing processes, tools, the role of military-government standards, and the role of offshore manufacturing and acquisition.

electronic packaging industry

Show Secondary and Basic Areas of Expertise
Expert may consult nationally and internationally, and is also local to the following cities: Baltimore, Maryland;  Frederick, Maryland;  Gaithersburg, Maryland;  Bowie, Maryland;  Richmond, Virginia;  Alexandria, Virginia;  Wilmington, Delaware;  and Lancaster, Pennsylvania.

Often requested
with this expert:

Surface Mount Technology
Semiconductor Industry IC Package Design and Development,...
Soldering Technology, Printed Circuit Boards, Intermetallic...
Electronic Assembly, Electronic Packaging

Year   Degree   Subject   Institution  
1982   PhD   Engineering Mechanics   University of Wisconsin, Madison  
1979   MS   Engineering Mechanics   University of Wisconsin, Madison  
1978   MS   Electrical Engineering   University of Wisconsin, Madison  
1976   BS   Acoustics   University of Wisconsin, Madison  

Work History:
Years   Employer   Title  

1985 to


CALCE Electronic Packaging Research Center, Expert's University


Founder and Director


1988 to 1990


Ramsearch, Inc.


Vice President


1983 to


(Undisclosed University)




Career Accomplishments:

Expert is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE), a Fellow of the American Society of Mechanical Engineers (ASME), and an Associate Fellow of the American Institute of Aeronautic Association (AIAA). He is a senior member of the Institute of Environmental Sciences (IES). He also holds memberships with the International Microelectronics and Packaging Society (IMAPS), the Institute for Interconnecting and Packaging Electronic Circuits (IPC), and the American Society of Materials International (ASM).



Professional Appointments

Currently, Expert is Chief Editor of Microelectronics and Reliability. He is Associate Editor for several publications, including IEEE Transactions on Electronic Components, Packaging, and Manufacturing Technologies; the International Microelectronics Journal; and the SAE Journal of Reliability, Maintainability, and Supportability.

Publications and Patents Summary

26 books on electronics and reliability over 400 publications over 100 industry courses 3 patents

Selected Publications and Publishers  
 - SAE International RMS Committee (G-11).  
 - CRC Press  
 - John Wiley Publishing Co.  

Consulting Services:
Recent Client Requests:
  • Expert in CAF to consult in formation theory and CAF failure verification method.
  • Expert for consulting on hi-rel component screening.
  • Expert for consulting on PCB Design Analysis.
Click the green button above to contact Expert for a free initial screening call regarding your expert consulting needs.  Expert is available for consulting to corporate, legal and government clients.  Remember, your initial screening call to speak with Expert is free.

Expert Witness:
Expert Witness Experience Summary:
On multiple law cases
Recent Litigation Client Requests:
  • Expert in manufacturing and QC for consulting on notebook computer power supply.
  • circuit design expert for consulting on analog electronics reliability.
Click the green button above to contact Expert for a free initial screening call regarding expert testimony, litigation consulting and support, forensic services, or any related expert witness services.  A few litigation needs include product liability, personal injury, economic loss, intellectual property (patent, trademark, trade secret, copyright), and insurance matters.  Remember, your initial screening call to speak with Expert is free.

International Experience:
Country / Region   Summary
Asia   Expert has experience in strategic planning with various foreign government agencies and industries in Japan, Taiwan, Malaysia, Singapore, Indonesia, and India. He has visited each of these countries many times over the past 10 years (recently concluded a 7-week tour of Malaysia, Taiwan, and India for the Army and the United Nations) and is currently part of the US Government (National Science Foundation) Japanese Technology Evaluation Center assessment group.

Additional Skills and Services:

Provides training and courses on reliability, electronics supply chain management and risk management


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