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 Expert  714785

Expert in Design for Test, Test Strategy, SMT Mfg, High-Speed Dig Design & PCB Layout, EMI/EMC, Digital Design

Available for your Consulting and Expert Witness Needs

Washington (WA)
Education Work History Career AccomplishmentsPublicationsConsulting Services Expert Witness

Summary of Expertise: Listed with other top experts in: 
Expert has over thirty year's experience in the design, manufacturing, and test areas. His initial education was in Industrial Engineering (IE) and Business Administration. After receiving his BSEE/MSEE, where he majored in digital design, computers, and software. Expert became highly involved in all aspects of electronic design and testing. As a digital design engineer, he designed many circuits used in missiles, airplanes, and commercial electronics. He has vast experience working on test-related issues in the laboratory and assembly line troubleshooting and perfecting circuit operation. As an IE he studied and implemented the “Time and Motion Study” Techniques which have culminated in the principles now expressed in the Hitachi and Boothroyd methods for DFA/DFM. He has played a very active role in automating the line, implemented robotics, participated in producibility studies, and automatic material handling. He has held positions responsible for overseeing and working in the CAE/CAD/CAT, JIT, simulation, and automatic material handling. Also, he has performed studies and headed research projects in the Computer Integrated Manufacturing environment, and has been the testability overseer for Boeing Commercial Airline products. Expert is highly involved in high-speed digital design training as well.

Expert has conducted tutorials and workshops at many trade shows, conventions, symposiums, and conferences in the United States and internationally. He has taught various electrical engineering classes at the University of Washington, Washington State University, and Seattle Community College. He has conducted special continuing engineering education classes for the University of Wisconsin, University of California - Berkeley, University of California - Los Angeles, George Washington University, Oregon Graduate Institute of Technology, Oxford University (England), and Seattle Pacific University.

Expert has performed on-site consulting with approximately seventy companies in the United States and internationally. He has taught personnel with virtually all Fortune 500 companies in the U.S.

Among honors Expert has received in industry was Boeing Aerospace Man of the Year Award which he won for consolidating testing techniques for the B1-B program that saved approximately $6,000,000.


concurrent engineering

He is proficient in several SMT implementation strategies including capital equipment considerations, assembly subcontractor partnerships, component selection and procurement, quality function deployment options, and cost-effective test strategies.

fine-pitch technology


surface mount resistor


surface-mount assembly


surface-mount equipment


surface-mount technology

Familiar with in-circuit test fault detection and fault isolation techniques, Expert applies his knowledge to correct manufacturing process problems. He has tested bareboards with blind and buried vias and controlled impedance requirements. He teaches a course entitled "Testing Surface Mount Technology: Practical Bareboard and In-Circuit Strategies" throughout the U.S., Asia, and England.

bare board


in-circuit tester


integrated-circuit built-in self test

Expert has expertise in electronics testing. He has extensive experience with through-hole, SMT, commercial, and military electronics. As a test strategist for Boeing, he is very knowledgeable in areas of component, in-circuit, board/system functional, continuity, and robotic testing. He has pioneered areas of built-in self-test, design for testability, and design for productibility. He has also concentrated on SMT test issues.

design for testability


electrical testing


electronics fault testing


electronics testing

Expert teaches SCAN techniques at companies and conferences nationwide and is very familiar with IEEE 1149.1 standard. He has designed IEEE 1149.1 boundary scan circuits into ASIC circuitry.

boundary scan test


electronics scan testing

Expert has provided in-plant test-production service to 23 companies, including Ford Motor Company, GE, Solectron, Boeing,

built-in self test


computer diagnostic testability measurement

Show Secondary and Basic Areas of Expertise
Expert may consult nationally and internationally, and is also local to the following cities: Seattle, Washington;  Tacoma, Washington;  Bellevue, Washington;  Everett, Washington;  Federal Way, Washington;  Kent, Washington;  Bellingham, Washington;  Lakewood, Washington;  and Renton, Washington.

Often requested
with this expert:

Electronics Reliability and Testing, Electronics Packaging...
Surface Mount Technology
Electronic Assembly, Electronic Packaging
Board & System Electronic Testing

Year   Degree   Institution  
1966   MSEE   Computers & Logic - University of Southern California  
1963   BSEE   Electrical Engineering - University of Washington  
1959   BSBA   Business Administration - University of North Dakota  
1959   BSIE   Industrial Engineering - University of North Dakota  

Work History:
Years   Employer   Title   Responsibilities

1991 to




Electronics/Test Instructor/Consultant


Train and consult in areas of expertise as listed in this bio.

1988 to 1991


Principal Engineer, Boeing Aerospace (Commercial AvionicsDivision )



1987 to 1988


Principal Engineer, Boeing Electronics Company



1985 to 1987


Assistant Manager, Manufacturing Test Engineering, Goodyear Aerospace



1982 to 1985


Project Engineer, Boeing Military Airplane Company



1977 to 1982


Project Engineer, Honeywell



1959 to 1977


Design & Software Engineer, Boeing Aerospace Co. & Rockwell



Career Accomplishments:

American Society of Test Engineers, SMTA, Society of Automotive Engineers (SAE)

Professional Appointments

Chair of various technical committees at various electronic trade shows (e.g. Nepcon, ATE and Instrumentation Conference, etc.)


Aerospace "Man of the Year" award at Boeing Military Electronics.

Publications and Patents Summary

Two test textbooks plus supplemental texts for all the areas of expertise taught.

Selected Publications and Publishers  
 - Self-published, used in context of training  
 - Self-published, used in training and/or a stand alone text  
 - Self-published, used in training  

Government Experience:
Years   Agency   Role   Description
2004 to   NASA Huntsville   Instructor   Training High-Speed Digital Design and EMI/EMC.
2006 to 2006   NASA Dryden   Instructor   Training High-Speed Digital Design and EMI/EMC.
2003 to   U.S. International Trade Commission   Instructor   Training ABCs of Electronic Technology and Digital Design
1987 to   Subcontractors for US Govt   Instructor/Consultant   He trains/consults for government sub-contractors including Boeing, Raytheon, Northup Grumman, DDI, Honeywell, 3M, Loral Aerospace, Martin-Marietta, Lockheed, Rockwell, SRI, TRW.

Consulting Services:
Selected Consulting Examples:
  • Intel. He conducted High-Speed Digital Design and ABCs of Electronic Technology training at the Intel Folsom, CA Facility.
  • IBM. He conducted High-Speed Digital Design and Advanced High-Speed Digital Design training at the Raleigh, NC facility.
  • AMD. He conducted High-Speed Digital Design, High-Speed Digital Design for Non-EEs, and Advanced High-Speed Digital Design at the Austin TX facility as well as at their facility in Dresden, Germany.
  • Texas Instruments. He conducts high-speed digital design, SMT Manufacturing, SMT Test, EMI/EMC, and Digital Design at the Dallas, TX facility.
  • Freescale Technology. He conducts high-speed digital design at the Novi, MI,, and Austin, TX facilities.
Recent Client Requests:
  • Water filtration expert for consulting on new product development.
  • Expert for consulting on Flex PCB Design and Manufacturing *KR
Click the green button above to contact Expert for a free initial screening call regarding your expert consulting needs.  Expert is available for consulting to corporate, legal and government clients.  Remember, your initial screening call to speak with Expert is free.

Expert Witness:
Recent Litigation Client Requests:
  • Expert in expert witness for Reexaminations.
Click the green button above to contact Expert for a free initial screening call regarding expert testimony, litigation consulting and support, forensic services, or any related expert witness services.  A few litigation needs include product liability, personal injury, economic loss, intellectual property (patent, trademark, trade secret, copyright), and insurance matters.  Remember, your initial screening call to speak with Expert is free.

International Experience:
Years   Country / Region   Summary
1996 to   Mexico   He provides training on SMT Manufacturing/Test, High-Speed Digital Design and EMI/EMC for the Mexitronica Conference in Guadalajara.
2001 to 2005   Union of South Africa   He provided training on SMT Manufacturing/Test, High-Speed Digital Design and EMI/EMC for the South African engineering community.
1997 to 2001   United Kingdom and Germany   He provides training on SMT Manufacturing/Test, High-Speed Digital Design and EMI/EMC for Oxford University, Xyratex, 3 Comm, Marconi, and also in Koln, Germany.
1996 to 2000   Singapore, Penang, Kuala Lumpur (Malaysia)   He provided SMT Manufacturing training to many personnel SE Asia through conferences held in the above countries/cities.
1994 to 1994   Korea   Samsung. He provided on-site training to Samsung on high-speed digital design.

Additional Skills and Services:

TEST SEMINARS The importance of concurrent design approaches in Testing Surface Mount Technology (SMT) becomes increasingly important as design complexity, shrinking package size, higher quality requirements, and global competition challenge all areas of electronic manufacturing. "Over the wall" engineering approaches often result in costly delays in production, untestable designs, and field reliability problems. Getting new products to market faster ultimately requires designs that are easier to produce, test, and service. This course defines methods used by successful manufacturing companies to achieve rapid prototypes, efficient design/manufacturing/test integration and minimizing factory costs and Just-In-Time (JIT).

Essentials of Electronic Technology Seminars: This course provides non-electrical engineer professionals with a practical, clear and jargon-free study of the essentials of high-tech electronics. The material is presented in a logical, step-by-step progression that starts with basic concepts and concludes with critical information about state-of-the-art microcomputers and communication gear. This course will improve familiarity with electronics including the latest cutting edge information, make communication with EE's clearer, improve customer confidence in electronics knowledge, and improve marketing, legal advice, engineering, and manufacturing.

Essentials of Digital Technology Course: This seminar focuses on the digital ICs that are the building blocks in a PC. Starting with basic logic-gate operations, the seminar carries you step-by-step through displays, memories, counters, I/O devices, and arithmetic circuits, finally offering you an opportunity to combine all components to build a PC. The information you learn in this course is critical because digital circuits and digital signal- processing techniques enhance the performance of equipment in such diverse business applications as communications, medical electronics, automotive electronics, and industrial process control. The most prevalent of all digital systems is the personal computer, which exemplifies a system that encompasses all types of digital circuits. HIgh Speed Digital Design Seminars for Non-EEs: The vast majority of digital designs today require disciplines of high-speed technology through all stages of the development process. Personnel responsible for the PCB layout, coordinating with bareboard manufacturer and overseeing the assembly processes need to be familiar with high-speed technology. The non-experts course provides insights into why high-speed boards require specific layer stacking, routing spaces and traces, keep away areas and power/ground layer requirements. For mechanical/thermal personnel, the requirements of heat transfer, PCB rigidity and component types become important issues. Parts procurement is also important today. Why are certain types of resistors, ICs and capacitors needed for high speed? Why can't we substitute and why are the lead times so long?


Layout Techniques, Routing, PCB Stackups, and Rework Issues: This course begins with a brief description of ball grid array (BGA) terminology, followed by a description of substrate materials and how they affect board performance. You will learn a method of calculating layer requirements for BGAs based on package layouts. You will also learn routing techniques to reduce layer count when using BGAs.

The Key Issues of EMI/EMC Issues Seminars: If you are an EE, you want to know why EMI testing is done, how it is conducted, and what the typical failures are, even if a special department or an outside EMI company does the actual testing. This course gives you the EMI information you need including design considerations at both CAE and CAD to provide a compliant radiation/susceptibility product. You'll examine and identify ways to prevent common EMI/EMC problems regarding power supplies, cables, connectors, slots, discontinuity


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