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 Expert  716910

Expert in Electronic Assembly, Electronic Packaging

Available for your Consulting and Expert Witness Needs

California (CA)
Education Work History Career AccomplishmentsPublicationsConsulting Services Expert Witness Market Research

Summary of Expertise: Listed with other top experts in: 
Expert is internationally renowned in the field of fine-pitch, chip scale, wafer level, and general surface mount electronic design and assembly. He is credited with founding the first U.S. based surface mount technology (SMT) contract design and assembly foundry and one of the first chip scale package companies. The contract manufacturing facility utilizes automated assembly lines and computer aided design (CAD) methods to aid in design for surface mount assembly. Expert is an expert in fine pitch and small component soldering techniques for surface mount, and these techniques include work involving solder paste, wave, and multiwave soldering, adhesive attach, and reflow soldering. He has managed product designs and manufacturing groups. His first company, AWI (now SCI's western division), is credited with designing and manufacturing many of the SMT "firsts." These include flex circuits, SMT land designs and workmanship standards, laptop computers, SIMM modules, portable medical products, disc drives, multi-chip products, and fine pitch products.

surface-mount soldering


solder paste


surface-mount assembly

Expert has spent the last 10 years studying and applying various assembly and design techniques to successfully utilize fine pitch (0.2 to 0.65 mm) surface mount components. He can provide information in the areas of designing land patterns, hole spacing, trace width, and thermal problems with SMT. His work with printed circuit boards includes solder plated copper (SMOPC) and solder mask over bare copper. He is also aware of the special requirements of rework and in-circuit testing such as bare board and test-to-node-methods when these are applied to SMT assemblies.

fine-pitch technology


surface-mount technology


electronic packaging


microelectronic packaging

Expert has a high degree of expertise with multi-chip modules and chairs two national standards efforts. He was chairman of the IPC/SMC Committee entitled MC-790 "Introduction to Multi-Chip Modules" and co-chairs MC-792 "Design Guidelines for Multi-Chip Modules." His experience with multi-chip modules includes the design and manufacture of multi-chip modules (MCMs) for Precision Monolithics in 1972, for Analog Devices in 1975, and for AWI in 1982. Expert has helped develop the first single in-line-memory-modules (SIMMs), the first flex circuit SMT assemblies, and the first monolithic, laser-trimmed, and high-resolution D/A and A/D converters.

multichip module

In 1992, Expert co-founded one of the first chip scale electronic packaging companies: ChipScale, Inc. This company has introduced a wafer level packaging technology for silicon and GaAs wafers. He is familiar with semiconductor packages that are up to 1.2 times the size of the semiconductor. Expert's work involved the management of the technical, marketing, and operations. He was involved in the process and standards development.

chip carrier

Expert has managed companies starting with as few as two partners up to a team of 250 employees. He has managed large projects with responsibility for forming and coordinating teams from multiple companies and countries. Expert has functioned as a short term, fill-in executive for companies. His primary functional role is usually business development, sales, marketing, and customer relationship improvement.

business management


business development

Expert has written and continues to write successfully implemented business plans. He has written broadly published market studies, and has been an advisor to upper management for several companies. Expert has been invited to sit on company Boards and on industry advisory boards. He is a mentor to start-ups at the local San Jose Business Cluster, advising start-up software, e-commerce, and environmental companies.

business strategy

Expert has over 30 years of development and production engineering and management experience in low- to high-volume electronic IC packaging.

electronic packaging industry

During Expert's over 30 years of IC packaging experience he has filed numerous patent disclosures and is named on five issued patents. His current expertise and work is in the area of wafer level packaging (WLP).

electronic packaging technology

Expert has started three Silicon Valley companies from scratch. He has negotiated millions in funding, joint ventures, and sales revenues for these and other companies. Expert has and continues to be a low-level angel investor in selected start-ups. He continues to be a mentor to start-up companies at the San Jose Business Cluster.


Expert has over 30 years of experience in IC packaging and backend (assembly and test).

integrated-circuit packaging process

Expert has mentored and guided several companies through strategic planning, market development, business development, and customer development.


Expert has written, presented, and defended several high level, high value proposals ranging from project requests, patent filings, legal briefs, and complete business plans.

proposal writing

Expert has managed development teams within large and startup companies.

research and development management

During his 30-plus years in the electronics industry, Expert was involved in a wide range of manufacturing experiences. This range started with silicon IC fabrication, through circuit board and box-level assembly and test.

electronics manufacturing

Show Secondary and Basic Areas of Expertise
Expert may consult nationally and internationally, and is also local to the following cities: San Jose, California;  San Francisco, California;  Sacramento, California;  Oakland, California;  Stockton, California;  Fremont, California;  Modesto, California;  Salinas, California;  Santa Rosa, California;  and Hayward, California.

Often requested
with this expert:

Surface Mount Technology
Electronic Packaging and Materials
Surface Mount Solders
Electronics Reliability and Testing, Electronics Packaging...

Year   Degree   Subject   Institution   Honors
1979   M.S.E.M. (M.S.E.E./M.B.A. Equiv.)   Engineering Management   University of Santa Clara   2nd in Class
1970   B.S.   Electronic Engineering   University of Florida   Dean's Citation for Self-Directed Research

Work History:
Years   Employer   Department   Title   Responsibilities

2003 to





Executive Director


Expert was appointed Executive Director of the 500+ member semiconductor assembly, packaging, and test organization in mid-2003. Expert still consults on: semiconductor wafer level and conventional packaging; PCB, SMT, and WLP (wafer level packaging) assembly; and business development.

1994 to 1998


ChipScale, Inc.





He was CEO of one of the first WLP companies in the industry. In addition to being CEO, Expert was a member of the technical team. ChipScale was issued 23 WLP patents.

1989 to 1994


PPM Associates





Expert provided SMT technical and management consulting.

1998 to 2001






VP, Business Development


He served in sales, marketing, and new product definition for a large Taiwan-based package assembly subcontractor.

2001 to 2002


Tru-Si Technologies



VP, WW Sales


Expert did technical sales of a line of silicon plasma wafer thinning and thin wafer handling equipment.

1981 to 1986


AWI, Sunnyvale





He was co-founder of one of the first SMT EMS companies in the U.S. It was later successfully acquired by SCI.

1986 to 1988


SCI Systems



Director of Advanced Technology


Expert was deployment manager of SMT into SCI's factories.

1976 to 1981


Philips Semiconductor




Business Unit Manager


He had P and L responsibility for an analog and data interface IC product unit.

Career Accomplishments:

Expert is a Senior Member of IEEE. He is also a member of Executive World.

Professional Appointments

He serves on the Expert's Firm Advisory Board, the SJBC Advisory Board, the ChipScale Board of Directors, and the EP&P Editorial Advisory Board.


Expert has received numerous speaking awards. He is a Charter Member of the Surface Mount Council. Expert is also the first unofficial recepient of the Boy Scouts of Americ electronics merit badge. He is an Eagle Scout, with three palms.

Publications and Patents Summary

He has five patents, and is the author of one text published by Van Nostrand Reinhold. He has produced 12 videos published by SME.

Selected Publications and Publishers  
 - Van Nostrand Reinhold  
 - Society of Manufacturing Engineers and PPM Associates  
 - PPM Associates  
 - Society of Manufacturing Engineers and PPM Associates  

Government Experience:
Years   Agency   Role   Description
1991 to 1992   NASA   Consultant   Expert was a consultant for the creation of NASA's SMT Workmanship Standards.
1990 to 1991   USAF   Consultant   He was a consultant to Westinghouse for the creation of an automated SMT rework and repair depot.

Consulting Services:
Selected Consulting Examples:
  • For 3Com, Cisco, and others, Expert created and implemented onsite SMT rework and repair training and "train the trainer" certification.
  • At Solectron, he implemented an inhouse (California ETP funded) SPC and Juran Quality training program. This helped Solectron win the Malcolm Baldridge Award.
  • Expert has provided management consulting for Benchmark and other companies.
  • He has provided onsite factory improvement asessments and recovery plans for several companies.
  • For Electronic Trend Publications, an industry market study publisher, Expert wrote the fine pitch SMT market study.
Recent Client Requests:
  • Expert for consulting on potting electrical assemblies.
  • Water filtration expert for consulting on new product development.
  • Expert for consulting on module manufacturing.
  • Expert in wire bonding for consulting on developing a surface mount chip that has (3) two pad dies.
  • Expert in memory chip manufacturing for consulting on current and future technology challenges (materials and process) in packaging.
Click the green button above to contact Expert for a free initial screening call regarding your expert consulting needs.  Expert is available for consulting to corporate, legal and government clients.  Remember, your initial screening call to speak with Expert is free.

Expert Witness:
Expert Witness Experience Summary:
Expert was an expert witness for SMT and electronic manufacturability issues in two cases.
Recent Litigation Client Requests:
  • circuit design expert for consulting on analog electronics reliability.
Click the green button above to contact Expert for a free initial screening call regarding expert testimony, litigation consulting and support, forensic services, or any related expert witness services.  A few litigation needs include product liability, personal injury, economic loss, intellectual property (patent, trademark, trade secret, copyright), and insurance matters.  Remember, your initial screening call to speak with Expert is free.

International Experience:
Years   Country / Region   Summary
1988 to 1992   Sweden: Erickson and Nokia   Expert provided seminars for SMT design and assembly implementation.
1987 to 1988   Italy: Olivetti   He gave seminars and was a management advisor for the improvement of their implementation of SMT.
1987 to 1989   Singapore   Expert was a seminar provider and consultant to various companies on SMT.
1990 to 1992   Taiwan: ITRI/ERSO   He was a seminar provider and consultant to ITRI/ERSO on SMT.
1987 to 1987   Korea: Samsung   Expert consulted on advanced IC packaging trends.

Market Research:
A large part of Expert's responsibility at his start-up and mentored companies is market and business development. This usually involves direct involvement with the company's sales force, senior management, and customers. Expert has developed an extensive network of industry friends and contacts that allow him to promote ideas and companies to the industry.

Click the green button above to contact Expert for a free initial screening call regarding your marketing research, industry research, and company research needs.  For research needs involving multiple experts or secondary research, a Research Director can be assigned to coordinate the work into a custom report for you as a potentially quicker and more cost effective alternative to doing this work yourself or hiring a boutique consultancy.  Remember, your initial screening call to speak with Expert is free.

Additional Skills and Services:

He has given numerous seminars internationally.

Other Skills and Services

Expert is cofounder of three companies: the first U.S. SMT manufacturing company; a consulting company; and one of the first wafer level packaging development companies. Two of these were VC funded. He has significant financial and company funding experience, ranging from angel, VC, institutional, and bank investors. Expert's participation in the founding, capitalization, and business plan authoring for AWI and ChipScale, Inc. has provided him with significant knowledge of the general semiconductor industry, and in particular the semiconductor backend industry.

In addition, Expert was the first authorized sales representative of the Juran Institute in the U.S.


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