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 Expert  721810

Expert in Electronic Packaging and Materials

Available for your Consulting and Expert Witness Needs

Arkansas (AR)
Education Work History Career AccomplishmentsPublicationsConsulting Services Expert Witness

Summary of Expertise: Listed with other top experts in: 
Expert has spent a portion of the past 10 years on improving the efficiency of multi-junction amorphous silicon solar cells. In particular, a large effort has been directed at understanding metal-induced crystallization of amorphous silicon and its application to the low temperature fabrication of solar cells.

Expert has performed research, and supervised students performing research, on a variety of materials utilized in microelectronics, such as silicon nitride, silicon oxynitride, silicon dioxide, YBCO, diamond-like carbon, and synthetic diamond, for more than 25 years. His work on these materials has been directed at their application to electronic devices and systems.

Expert has devoted the past 10 years to electronic packaging technologies, and in particular, multi-chip modules. During this time he has developed a strong background in electronic packaging in general. He contributed to and edited a textbook entitled "Advanced Electronic Packaging," published by the IEEE PRESS in 1999.

Expert has been involved with the High Density Electronic Center (HiDEC) since its creation in 1991. This center is devoted to advanced electronic packaging technologies. Expert has been involved in a large number of research projects that addressed different aspects of microelectronics packaging.

Expert is familiar with all aspects of multichip module packaging. He contributed to and edited the book "Advanced Electronic Packaging," published by the IEEE PRESS in 1999. He also teaches portions of two graduate level courses on electronic packaging.

Expert has performed and supervised research on solar cells for the past 30 years. He began with crystalline silicon and most recently worked in research on amorphous silicon and amorphous silicon solar cells.

Expert began working in the semiconductor area in 1969. He has taught courses in semiconductor device fabrication and presently teaches courses in electronic manufacturing processes and advanced electronic packaging. Over this period of time, Expert has gained an overall appreciation and knowledge of semiconductor packaging technology.

Having worked in semiconductor technology essentially his whole engineering career, and having concentrated on semiconductor materials, Expert has acquired and utilizes his many years of experience with materials performing research in the packaging of semiconductor devices. He is the author of two chapters in the book “Advanced Electronic Packaging.” He wrote Chapter 1 - Introduction and Overview of Microelectronics Packaging and Chapter 2 - Microelectronics Packaging Materials and Applications.

Expert has strong background in semiconductor processing and in research on materials used in microelectronic. He is experienced in material deposition, characterization, and application. He has particular strengths in the synthesis of new materials using both PVD and CVD techniques. He also has experience in laser processing of materials.


amorphous semiconductor


amorphous photovoltaic cell


amorphous silicon


photovoltaic cell


amorphous silicon solar cell


electronic material


electronic packaging


electronic packaging technology


multichip module packaging process


photoconductive material


semiconductor device package


semiconductor device packaging material


semiconductor material processing

Show Secondary and Basic Areas of Expertise
Expert may consult nationally and internationally, and is also local to the following cities: Tulsa, Oklahoma;  Broken Arrow, Oklahoma;  Fort Smith, Arkansas;  Fayetteville, Arkansas;  and Springfield, Missouri.

Often requested
with this expert:

Electronic Assembly, Electronic Packaging
Reliability, Maintainability
Semiconductor Industry IC Package Design and Development,...
Electronics Reliability and Testing, Electronics Packaging...

Year   Degree   Subject   Institution   Honors
1975   PhD   Electrical Engineering   The University of New Mexico  
1970   MS   Electrical Engineering   The Pennsylvania State University  
1969   BS   Electrical Engineering   (Undisclosed University)   High Honors

Work History:
Years   Employer   Department   Title   Responsibilities

1998 to


(Undisclosed University)


College of Engineering


Associate Dean for Research


1983 to 1998


(Undisclosed University)


Electrical Engineering


Department Head


1977 to 1983


(Undisclosed University)


Electrical Engineering


Department faculty


1969 to 1977


Sandia National Laboratories


Division 2114


Member Technical Staff


He was responsible for the development of nonvolatile memory technology, radiation hardening of CMOS. Also, the development of single-crystal silicon solar cells.

Career Accomplishments:

Expert is a member of the IEEE, IMAPS, AVS, ECS, ASEE and the MRS.


He is a licensed PE in the state of Arkansas.

Professional Appointments

Expert is a member of the Editorial Advisory Board of Microelectronics and Reliability (1990-1998) and the Executive Committee of the International Petroleum Environmental Consortium (1999-present). He also is the regional Editor of Microelectronics and Reliability (1993-1996).


Expert is a member of the Arkansas Academy of Electrical Engineering (1989). In 1996, he received the Thomas D. Callinan Award from Dielectric Science and Technology, which is a Division of the Electrochemical Society.

Publications and Patents Summary

He has 220 journal/proceedings publications, 250 technical conference/workshop presentations, eight U. S. patents, and three books. The books are “Advanced Electronic Packaging,” published by IEEE PRESS; “Nonvolatile Semiconductor Memory Technology,” by IEEE PRESS; and “Electronic Manufacturing Processes,” by Prentice Hall.

Selected Publications and Publishers  
 - IEEE Transactions on Advanced Packaging, Institute of Electrical and Electronics Engineers (IEEE)  
 - International Journal of Microcircuits and Electronic Packaging  
 - Applied Physics Letters  
 - Thin Solid Films  
 - International Journal of Microcircuits and Electronic Packaging  

Government Experience:
Years   Agency   Role   Description
1991 to   DARPA   Team Member   He was involved in several research and development activites at the University of Arkansas High Density Electronics Center (HiDEC) funded by DARPA.
1977 to   NSF, NASA, ARO, AFOSR, NRL, NSF   Researcher   Expert was involved with numerous research and development contracts with several government entities/agencies as noted above.

Consulting Services:
Selected Consulting Examples:
  • He consulted for private industry on the application of synthetic diamond technology to microelectronics.
  • He consulted for a government agency on semiconductor device design and fabrication by reverse engineering.
  • He consulted for private industry on semiconductor fabrication technology for hot carrier injection in CMOS EPROMs.
  • He consulted for private industry on electromigration and corrosion of metallization systems for integrated circuits.
  • He consulted for private industry on radiation hardening of linear CMOS circuits built in SOI.
Recent Client Requests:
  • Expert in semiconductor for consulting on a benchmarking audit of our sputtering (PVD) module relative to best-of-breed practices/ products.
  • Expert in memory chip manufacturing for consulting on current and future technology challenges (materials and process) in packaging.
Click the green button above to contact Expert for a free initial screening call regarding your expert consulting needs.  Expert is available for consulting to corporate, legal and government clients.  Remember, your initial screening call to speak with Expert is free.

Expert Witness:
Expert Witness Experience Summary:
He has consulted on semiconductor fabrication technology in federal courts.
Click the green button above to contact Expert for a free initial screening call regarding expert testimony, litigation consulting and support, forensic services, or any related expert witness services.  A few litigation needs include product liability, personal injury, economic loss, intellectual property (patent, trademark, trade secret, copyright), and insurance matters.  Remember, your initial screening call to speak with Expert is free.

Additional Skills and Services:

He has taught courses in electronic packaging, electronic manufacturing processes, the physics of semiconductor surfaces, and radiation effects in microelectronics.


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