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 Expert  722526

Expert in Materials and Processes of Semiconductor Microelectronic Products


Available for your Consulting and Expert Witness Needs

California (CA)
USA
Education Work History Career AccomplishmentsPublicationsConsulting Services Expert Witness Market Research

Summary of Expertise:

Listed with other top experts in: 

Expert has experience in semiconductor crystal growing, epitaxial, wafer processing, product engineering, wafer sorting, process control monitors, materials, equipment, quality, reliability, failure analysis, packaging and assembly, reports and great at establishing teams together and conducting them to a successful solution.
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semiconductor device

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semiconductor device testing

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semiconductor material

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semiconductor wafer

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silicon wafer

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semiconductor device package

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semiconductor device packaging material

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semiconductor device packaging process

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electronic packaging industry

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semiconductor device analysis


Show Secondary and Basic Areas of Expertise
Localities:
Expert may consult nationally and internationally, and is also local to the following cities: Fresno, California;  Bakersfield, California;  Salinas, California;  Santa Barbara, California;  Visalia, California;  and Santa Maria, California.

Education:
Year   Degree   Subject   Institution  
1962   AA   Pre-Professional   San Jose City College  
1962   Erste Prufung   18th Century Philosophy, Music, and Literature   University of Heidelberg, Germany  
1966   BA   Analytical Chemistry / German   San Jose State University  
1968   Pre-Masters   Chemical Engineering   San Jose State university  

Work History:
Years   Employer   Department   Title   Responsibilities

2003 to 2004

 

Self Employed

 


 

President

 

Responsible for 12 expert principles in the semiconductor industry.

1999 to 2003

 

OSE-USA, Inc.

 

Research and Development

 

Vice President

 

Responsible for materials and processes for advanced interconnect micro electronic products. Sustained assembly facilities in Kaohsiung, Taiwan and Manila, Philippines.

1999 to 1999

 

Pac Tech USA

 

USA Sales and Marketing

 

President

 

Set up Sales and Marketing organization in USA for German Flip Chip company. Sustained manufacturing facilities in Nauen and Berlin, Germany.

1996 to 1999

 

ChipPac, Inc.

 

Package and Assembly

 

Director

 

Micro electronic package design, materials, modeling, development, transfer to production. Sustained assembly facilities in Santa Clara, CA; Ichon, Korea, and Shanghai, China.

1994 to 1996

 

GateField, Inc.

 

Product Engineering

 

Director

 

Field Programmmable Gate Array product, testing, development and transfer to production. Sustained assembly operations in Hong Kong and wafer fab operations in Kyoto, Japan.

1992 to 1994

 

Synergy Semiconductor

 

Manufacturing

 

Director

 

ECL Logic, RAMS, and ASIC product engineering, testing, production, & transfer to German organization. Sustained electrical testing in Santa Clara, CA; assembly facilities in Kita Kyushu, Japan and Frankfurt on der Oder, Germany

1986 to 1992

 

VLSI Technology, Inc.

 

Research and Development

 

Engineering Manager

 

Micro electronic ASIC, Cell Based product, package design, development, and transfer into production. Sustain facilities in Mexicali, Mexico; Seoul, Korea, and Hokkaido, Japan.

1983 to 1986

 

SEEQ Tehcnology

 

Packaging and Assembly

 

Engineering Manager

 

Established an assembly captive line for EPROMS, EEPROMS, and Ethernets in Seoul, Korea.


Career Accomplishments:
Associations/Societies

a. Board of local Components, Packaging and Manufacturing Technology (CPMT); b. Institute of Electrical and Electronics Engineers, Inc. (IEEE); c. Micro Electronics packaging and Test Engineering Council (MEPTEC)

Licenses/Certifications

STMG Business License

Professional Appointments

a. Ex president of Pac Tech, USA; b. Current president of STMG

Awards/Recognition

Won 1989 Best Technical Paper Award at International Tape Automated Bonding Symposium (ITAB) Symposium.


Publications:
Publications and Patents Summary

a. Numerous technical articles in various semiconductor magazines. b. Application Notes on Product, Assembly, Testing, and Reliability, at National Semiconductor, VLSI Technology, Synergy Semiconductor, and GateField Data Books.


Consulting Services:
Selected Consulting Examples:
  • 2003-2004 business strategies for medical packaging, assembly, and electrical testing organization.
  • 2003-2004 business plan for local sub-contract assembly house on expanding their business by 100%.
  • 2004 business plan for largest US wire bonder organization on setting up a new, more efficient, better quality, less cost for test sockets and test load boards.
  • Set up back end cost modeling for electrical test, materials, packaging, and assembly for new local Ethernet organization. organization
  • Consulted for IPAC and GateField in 1995 in running their manufacturing groups.
Recent Client Requests:
  • Expert for consulting on Glass to Metal debonding caused by contamination.
  • Expert in Semiconductor chemicals for consulting on materials business opportunities, and strategy development.
Click the green button above to contact Expert for a free initial screening call regarding your expert consulting needs.  Expert is available for consulting to corporate, legal and government clients.  Remember, your initial screening call to speak with Expert is free.

Expert Witness:
Click the green button above to contact Expert for a free initial screening call regarding expert testimony, litigation consulting and support, forensic services, or any related expert witness services.  A few litigation needs include product liability, personal injury, economic loss, intellectual property (patent, trademark, trade secret, copyright), and insurance matters.  Remember, your initial screening call to speak with Expert is free.

International Experience:
Years   Country / Region   Summary
1999 to 2003   Kaousiung, Taiwan and Manila, Philippines   Developed microelectronic packages at San Jose, Ca. Sustained assembly and electrical testing facilities in Taiwan and Philippines.
1999 to 1999   Nauen and Berlin, Germany   Established flip Chip UBM and bumping Sales and Marketing Office in Fremont, Ca. Manufacturing was in Nauen and Berlin. Germany.
1996 to 1999   Ichon, Korea and Shanghai, China   Sustained microelectronic packaging and assembly facilities in California, Korea, and China.
1994 to 1996   Kyoto, Japan and Hong Kong   Sustained wafer fabrication from Rohm in Japan and packaging and assembly in Hong Kong. Electrical testing was done at Fremont, CA.
1992 to 1994   Franfurt on der Oder, Germany   Sustained microelectronic packaging, assembly, and electrical testing at Santa Clara, Ca and Germany. Transfered process and product to Germany.

Language Skills:
Foreign Language   Description
Spanish   Spoke Spanish until he went to school in the US. Very fluent in Spanish
German   Studied and graduated with German as a double major from University. Studied German at U of Heidelberg. Used German in transfering product to Germany.
French   Studied French in high school and first two years in college. A bit rusty but can interview in French.
Italian, Portugese, Japanese   Can speak about 50% in Italian and Portugese. Three semesters of Japanese at Stanfor University; used it in Japan.

Market Research:
Set up USA Sales and Marketing office in Fremont , Ca for Pac Tech, a German organization.

Click the green button above to contact Expert for a free initial screening call regarding your marketing research, industry research, and company research needs.  For research needs involving multiple experts or secondary research, a Research Director can be assigned to coordinate the work into a custom report for you as a potentially quicker and more cost effective alternative to doing this work yourself or hiring a boutique consultancy.  Remember, your initial screening call to speak with Expert is free.

Additional Skills and Services:
Training/Seminars

a. Courses in German at Heidelberg, solid state physics at Fairchild and Cal, U of Berkeley, AMA business courses, QA Control program at local college, EE courses at Stanford U, ISO9000 Implementation and Audit, Nat Stds of Ireland, Target Total Quality Mgmt. b. Invited EE teaching instructor at San Jose Stae University under US Sceince Foundation Grant.

Supplier and Vendor Location and Selection

a. Materials: Dexter, Sumitomo, Namics, Hysol, Mitsui Chemical, Kinsus, PPT, American Wire, Tanaka Wire, Nitto mold compound, etc. b. Equipment: Wafer sorters, final electrical testers, Flip Chip machines, wire bonders, cure ovens, pick and place equipment, dia attach equipment, etc. Too numerous to mention here.

Other Skills and Services

Semiconductor crystal growing, epitaxial, wafer processing, product engineering, wafer sorting, process control monitors, materials, equipment, quality, reliability, failure analysis, packaging and assembly, reports and great at establishing teams together and conducting them to a successful solution.


 

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