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 Expert  723560

Expert in Semiconductor Industry IC Package Design and Development, Consulting and Training

Available for your Consulting and Expert Witness Needs

California (CA)
Education Work HistoryPublicationsConsulting Services Expert Witness

Summary of Expertise: Listed with other top experts in: 
Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers

electronic packaging


fine-pitch technology


low-dielectric constant printed circuit carrier

Expert has Ph.D. in analyzing interconnection technologies, including High-speed packaging, circuit simulation, HF simulation, electromagnetic simulation, crosstalk.

interconnection technology

Expert has over 20 years of experience in design, development and analysis of IC packaging, including multichip modules, system in packages, leadless chip carriers, leadframe packages

leadless chip carrier

Expert has over 20 years of experience in design, development and analyzing of electronic packages particularly multichip modules/system in packages, ball grid arrays, land grid arrays

multichip module


multichip module packaging process

Expert has been involved in all steps of packaging and PCB substrate development including defining design rules, design guidelines and material selection for substrates, PTH vias, printed board assembly, laminate or ceramic materials, design for manufacturability

plated through-hole via


printed board assembly


printed circuit


printed circuit board design


printed circuit board design guideline


printed circuit board design-for-assembly


printed circuit board design-for-manufacturability


printed circuit board laminate

Show Secondary and Basic Areas of Expertise
Expert may consult nationally and internationally, and is also local to the following cities: Los Angeles, California;  San Diego, California;  Long Beach, California;  Santa Ana, California;  Anaheim, California;  Riverside, California;  Glendale, California;  Huntington Beach, California;  San Bernardino, California;  and Chula Vista, California.

Often requested
with this expert:

Electronics Reliability and Testing, Electronics Packaging...
CFC Alternatives, Electronics; Circuit Board; Circuit Board...
RF, RF Linearization, RF Amplifiers, RF Components
Power Semiconductor Devices

Year   Degree   Subject   Institution  
1992   PhD   Electrical Engineering   Technical University of Berlin  
1986   MSEE   Electrical Engineering   Technical University of Berlin  

Work History:
Years   Employer   Department   Title   Responsibilities

2006 to


(Undisclosed Consulting Company)



(Undisclosed Consulting Company)


·Independent Consulting in IC Packaging design and development, Electrical Analysis ·Material selection for Packaging Materials, including Substrates, Die Adhesives, Encapsulation, Interconnection ·Vendor sourcing and interaction for product development

2004 to 2006


Meggitt Electronics Endevco


Systems Engineering


Project Engineering Manager


·She managed the development team including packaging, materials, electrical, mechanical, and software engineers ·She coordinated and led product development within Stage Gate Process, troubleshooting, and testing of new systems for smart sensors, MEMs, MOEMs using Six Sigma/DOE principles ·Ensured proper transition of new products to Integration and Manufacturing Engineering

1999 to 2004


Conexant Systems Inc.


IC Packaging and Assembly


Principal Packaging Engineer


·Managed several projects with cross-functional teams from IC design to package manufacturing, test and reliability to achieve cost reduction on wafer and package level and improve the technology. ·Developed design guidelines and product package roadmaps, aligning business needs with technical advancements ·Assessed emerging technologies (Flip Chip, stacked die, scribe line reduction). ·Developed new packages introducing new product design rules for the company's next generation of RF-IC products (e.g. world's smallest Power Amplifiers, LNAs, and Bluetooth). Worked closely with substrate and assembly manufacturers and cross-functional teams ·Performed electrical analysis of IC packages in Simultaneous switching noise, IBIS modeling, and parasitic analysis ·Reviewed package layouts for all advanced packages from Leadframe, RF-LGA and Multichip Modules to high I/O Ball Grid Array. ·Consulted different divisions for package selection, product design and design analysis prior to and post layout, input on cost, material and technology, gave workshops on Advance Packaging technologies

1995 to 1999




Multichip Modules


Head of Department


Managed a group of 19 scientists/engineers. Led projects within Package Design, RF modeling and simulation, EMC/EMI analysis, HF measurement and test, and software development. Coordinated the priorities, schedules and budgets for the Research and Engineering. Worked in research and development of advanced IC packages. ·Used Ansoft HFSS, Q3D/Q2D, PSPICE/HSPICE. ·Authored numerous chapters in the books: Direct Attachment of ICs (German, Editor Prof. Reichl) and EMC Cookbook for PCBs (German).

1987 to 1994


Technical University of Berlin




Research Associate


Worked towards PH.D in Package Electrical Analysis, wrote a software program to support package design and SI analysis.

Publications and Patents Summary

Over 35 scientific publications and contributions to international conferences on High Speed Packages and related areas ·Several chapters in Books: -Electromagnetic Compatibility EMC-Cookbook for PCBs (German) and in -Direct Attachment of Integrated Circuits (German, Editor Prof. Reichl) ·Chairman of workshop “ Introduction to MCM and MCM design” (Nov 98 and Feb 99) ·Organization and presentation of several seminars on Signal Integrity, MCM and Advanced Package Technologies

Consulting Services:
Recent Client Requests:
  • Package substrate design expert for consulting on package and substrate design.
  • Expert in design critea for electronics made on ceramic substrate.
  • Expert for consulting on PCB Design Analysis.
  • Expert for consulting on Soleniod Valve project has encountered problems.
  • Expert in Carbon Ink Printed Circuit Boards.
  • Expert in circuit board developer for consulting on fireplace.
Click the green button above to contact Expert for a free initial screening call regarding your expert consulting needs.  Expert is available for consulting to corporate, legal and government clients.  Remember, your initial screening call to speak with Expert is free.

Expert Witness:
Click the green button above to contact Expert for a free initial screening call regarding expert testimony, litigation consulting and support, forensic services, or any related expert witness services.  A few litigation needs include product liability, personal injury, economic loss, intellectual property (patent, trademark, trade secret, copyright), and insurance matters.  Remember, your initial screening call to speak with Expert is free.

International Experience:
Years   Country / Region   Summary
1987 to 1999   Berlin/Germany   Expert worked in different positions at the Technical University and at the Fraunhofer Institute for packaging research and development

Language Skills:
Foreign Language   Description
German   She speaks fluent in German
Turkish   She speaks fluent Turkish

Additional Skills and Services:

·She organized and presented several seminars on Signal Integrity, MCM and Advanced Package Technologies

Supplier and Vendor Location and Selection

She has experience in locating package substrate manufacturers, package assembly vendors


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