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 Expert  723792

Expert in Hybrid Thick Film Circuit Layout, Low Temperature Co-fired Ceramics: Design and Manufacturing

Available for your Consulting and Expert Witness Needs

Maryland (MD)
Education Work History Career AccomplishmentsPublicationsConsulting Services Expert Witness

Summary of Expertise:

Listed with other top experts in: 

Expert has worked in the forefront of developing technology in the area of electronic ceramics for over thirty years, ranging from the early high-alumina ceramic substrate refinement for additive and subtractive microelectronic packaging circuit pattern definition to the advanced glass-ceramic substrate materials known as Low-Temperature Cofired Ceramics. He has applied these materials to RF and Microstrip configurations for low-power microelectronics in ceramic multi-conductor layer circuit boards. His innovations have included creation of cavities for containment of chip components, techniques for interconnecting chip components to the conductors within the multilayer structure, low loss, low dielectric constant ceramics for low-power level Microwave ceramic package structures, high-dielectric constant materials for buried passive components (capacitors), and high resistivity conductors for resistors buried within the glass-ceramic three-dimensional structure (body).

ceramic material selection

Show Secondary and Basic Areas of Expertise
Expert may consult nationally and internationally, and is also local to the following cities: Philadelphia, Pennsylvania;  Reading, Pennsylvania;  Lancaster, Pennsylvania;  Baltimore, Maryland;  Frederick, Maryland;  Gaithersburg, Maryland;  Bowie, Maryland;  Wilmington, Delaware;  Vineland, New Jersey;  and Alexandria, Virginia.

Year   Degree   Subject   Institution  
1959   BS   Physics   University of Detroit  
1961   MS   Physics   University of Detroit  

Work History:
Years   Employer   Department   Title   Responsibilities

2002 to 2005




ESG-Engineering Services Group


Sr. Contractor Engineer


Expert was assigned to an ESG client, Northrop Grumman Electronic Systems in Baltimore MD. Reporting to the VP of Engineering,he served as Liaison for placement of Key Engineering Talent (PhD, Senior Advisory Engineers) for the Electronic Systems Sector; He also provided Systems Engineering Support for standardization of Systems Engineering processes across all Northrop Grumman Corporation Sectors.

2000 to 2001






Sr. Contractor Engineer


Assigned to Northrop Grumman, Baltimore. Assisted in recruitement and placement of electro-optics engineers. Maintained equipment in three EO labs, including their calibraton.

1997 to 1998






Sr. Contractor Engineer


Assigned to Northrop Grumman, Baltimore. Responsible for Cost Proposals for many EO Systems. Assisted in recruitment and placement of electro-optics engineering candidates.

1996 to 2003


Technology Seminars, Inc.




Associate Lecturer


Conducted In-Plant seminars on Hybrid Electronic Packaging, Advanced Materials Technology, High-Speed and Microwave Packaging. Clients included Automotive Industry, NSA, NASA, various Lucent Locations. Contributed chapters to five McGraw-Hill Electronic Engineering Handbooks. Co-authored a book on Electronic Packaging of High Speed Circuitry

1965 to 1995


Westinghouse Electronic Systems (Now Northrop Grumman Electronic Systems)




Senor Engineer, Fellow Engineer, Advisory Engineer


Electronic Packaging of Hybrid Circuits. Included Thick Film circuitry on Ceramics, Thin Film Circuitry, Low Temperature Co-Fired Ceramics, Engineering Materials development for hybrid circuit conductors and insulating materials, wire bonding, chip bonding, microwave (microstrip) package and miniature coaxial connector development

1961 to 1965


Sperry Gyroscope Company


Air Armament




Electronic packaging and welded module development for solid state devices, including transistors and other miniature discrete components (resistors, capacitors, varactors) for airborne and submarine computers.

1959 to 1961


University of Detroit


Graduate Program in Physics


Teaching Fellow


Setting up experiments in General Physics for undergraduate students, teaching the lab courses, grading lab reports and quizes.

Career Accomplishments:

Vice-President for Technology, Board member and Technical Program Chairman, Internatonal Electronics Packaging Society Symposium; Technical Session Chairman, National Electronic Packaging Conference (NEPCON) three years; Tech Session Chairman, Society for the Advancement of Material and Process Engineering (SAMPE) (1992).

Publications and Patents Summary

Four U.S. Patents and an additional 16 Invention Disclosures, two of which were determined by Westinghouse to be best kept as trade secrets, Contributed five chapters to McGraw-Hill Engineering Handbooks in Electronic Packaging Technology, and co-authored the McGraw-Hill Engineering book, “Electronic Packaging of High Speed Circuitry” (1997), Twenty technical papers on various aspects of hybrid electronic packaging, typical of which are these: "Evaluation of Multilayer Circuitry on Alluminum Nitride", "Some Materials Considerations for High-Speed Digital and Microwave Circuitry".

Selected Publications and Publishers  
 - McGraw-Hill  

Consulting Services:
Recent Client Requests:
  • Expert in design critea for electronics made on ceramic substrate.
  • Expert in LTCC process development to assess multilayer production process and equipment.
Click the green button above to contact Expert for a free initial screening call regarding your expert consulting needs.  Expert is available for consulting to corporate, legal and government clients.  Remember, your initial screening call to speak with Expert is free.

Expert Witness:
Click the green button above to contact Expert for a free initial screening call regarding expert testimony, litigation consulting and support, forensic services, or any related expert witness services.  A few litigation needs include product liability, personal injury, economic loss, intellectual property (patent, trademark, trade secret, copyright), and insurance matters.  Remember, your initial screening call to speak with Expert is free.

Additional Skills and Services:

Gave many in-plant seminars on the following topics: Electronic packaging technologies for High-Speed Digital and miniaturized microwave circuits, Advanced materials usage for high performance circuit packaging (High-Speed circuitry on printed wiring boards)

Supplier and Vendor Location and Selection

Worked to develop suppliers of thin film circuit resistor ladder networks, spending four months with three suppliers in the Boston area, assisting them in refining their thin film materials deposition and photoengraving pattern definition processes thereby making notable improvements in quality and yields.


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