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 Expert  725449

Expert in Semiconductor Wafer and Packaging Materials, Process, Equipment & Quality


Available for your Consulting and Expert Witness Needs

Arizona (AZ)
USA
Education Work History Career AccomplishmentsPublicationsConsulting Services Expert Witness Market Research

Summary of Expertise:

Listed with other top experts in: 

Semiconductor Manufacturing Processes and Control
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semiconductor material processing

 • 

semiconductor wafer processing

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semiconductor product quality control

 • 

integrated-circuit manufacturing

Electronic Assembly and packaging
 • 

design for assembly

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design for manufacturability

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design-for-quality

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integrated circuit assembly

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manufacturing cost control

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solder paste quality control

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supplier quality engineering

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assembly engineering

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design for manufacture and assembly

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discrete manufacturing

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integrated-circuit packaging process

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high volume, low cost product assembly

Project / Program Management
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engineering project management

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project cost engineering

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vendor quality auditing

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development engineering management

Metallurgical Engineering & Materials
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metal chemical analysis

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metal failure analysis

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metal heat treatment quality control

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metal testing

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metallurgical engineering

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microstructure analysis


Show Secondary and Basic Areas of Expertise
Localities:
Expert may consult nationally and internationally, and is also local to the following cities: Phoenix, Arizona;  Mesa, Arizona;  Glendale, Arizona;  Scottsdale, Arizona;  Chandler, Arizona;  Tempe, Arizona;  Gilbert, Arizona;  and Peoria, Arizona.

Education:
Year   Degree   Subject   Institution   Honors
1966   B.S.   Metallurgical Engineering   Univ of Missouri, School Of Mines   multiple scholarships
2001   Masters   Program Management   George Washington University  
1974   Masters Program - incomplete 12 hours   Inorganic Chemistry   Vassar College - IBM Program  
1970   Master Program - incomplete 9 hours   Solid State Physics   Syracuse  
1984   PhD program - incomplete 16 hours   Materials Engineering   Univ of Arizona  

Work History:
Years   Employer   Department   Title   Responsibilities

2001 to

 

(Undisclosed Consulting Company)

 


 

President, Principal Consultant

 

He has performed multiple consulting engagements on wafer thinning, interconnection, laser dicing, six sigma training, equipment and transport of 35um thick wafers, die cracking and analysis, stacked wafers and stacked chips, scribing and due diligence of semiconductor technology.

1998 to 2001

 

ON Semiconductor

 

International Manufacturing

 

Director Mfg Technologies & Program Manager

 

He directed a global team of engineers in 8 countries in all areas of manufacturing materials, processes, equipment, automation, finite element analysis, design for manufacturability, wafer cost reductions, new technologies, Pb-free processing, technology development with Philips on joint factory in Malaysia. He provided joint project management & development of wafer dicing and laser dicing, minimized saw street & analysis.

1993 to 1998

 

Motorola

 

Semiconductor

 

Director Internation Manufacturing Technology Centers

 

His responsibilities were the same as what his responsibilities were in ON Semiconductor which was a spin-off of Motorola.

1987 to 1993

 

Digital Equipment Corp.

 

Corporate Consulting and Sales Support

 

Senior Consulting Area Manager

 

Initially, he was the operations manufacturing manager and task Force leader for microprocessor qualification - 3 years Assumed Western USA responsibility to support DEC Sales in pre-sales technical consulting and business opportunity identification (engineering and manufacturing).

1984 to 1987

 

Intel Corp

 

Assembly and Test

 

Manager Advanced Processes

 

He staffed and managed a semiconductor assembly development group charged with new product introduction and cost reduction for 386 microprocessor. He Program Managed a major technology transfer and exchange project with uEM in Switzerland exchanging Intel wafer processing for uEM Tape Automated bonding and wafer bumping technology.

1967 to 1984

 

IBM

 

Components Divsion, East Fishkill NY

 

6 promotions as engineer to Senior Engineer

 

He worked in Materials, Process and Equipment development for IBM flip Chip and advanced package concepts, including thermal conduction modules, tape automated bonding, GaAs wafer processing and packaging and advanced packages for high speed computers.


Career Accomplishments:
Associations/Societies

IEEE Full Member ASTM ASME AIME

Licenses/Certifications

He holds a Master's Certification Project Management - George Washington University 2001.

Professional Appointments

He has been the Chairman ASTM Committees in wafer bumping and Tape Automated Bonding Standards.

Awards/Recognition

IBM Patent Level Awards (3rd tier) (32+ patents) IBM Outstanding Achievement Awards (5) Motorola Patent Award; ON Semi Patent Award Major Cost Reduction Award and Bonus (ON Semi)


Publications:
Publications and Patents Summary

He has over 20 publication in IBM Journal of Research & Development: Semicon presentations (3); Publications in Advanced Packaging Magazine; Publication In Future Fab Magazine.


Consulting Services:
Selected Consulting Examples:
  • Senior Western USA Consulting Manager for Digital Equipment Engineering and Manufacturing - likely 20+ major clients like Intel, Motorola, US Navy, Signetics, Medtronics, Whirlpool, Jared.
  • He has consulted on Quality, Business Process Re-Engineering, Efficiency, Cost, Board Soldering, Lead-free Solder,
  • Extended consultinhg contract for Tru-Si Technologies on processing of ultra-thin silicon wafers; thru-hole contacts; equipment developments
Click the green button above to contact Expert for a free initial screening call regarding your expert consulting needs.  Expert is available for consulting to corporate, legal and government clients.  Remember, your initial screening call to speak with Expert is free.

Expert Witness:
Click the green button above to contact Expert for a free initial screening call regarding expert testimony, litigation consulting and support, forensic services, or any related expert witness services.  A few litigation needs include product liability, personal injury, economic loss, intellectual property (patent, trademark, trade secret, copyright), and insurance matters.  Remember, your initial screening call to speak with Expert is free.

International Experience:
Country / Region  
Malaysia  
Switzerland  
Thailand  
Holland  
Singapore  

Market Research:
His industry insights include: Advisory Board MEPTEC; Advisory Board Advanced Packaging Magazine; ASTM Committee Chairman Wafer Bumping; ASTM Committe Chairman Tape Automated Bonding.

Click the green button above to contact Expert for a free initial screening call regarding your marketing research, industry research, and company research needs.  For research needs involving multiple experts or secondary research, a Research Director can be assigned to coordinate the work into a custom report for you as a potentially quicker and more cost effective alternative to doing this work yourself or hiring a boutique consultancy.  Remember, your initial screening call to speak with Expert is free.

Additional Skills and Services:
Training/Seminars

He delivered six sigma training to 3M in Rochester and trained IBM technicians' class for 16 weeks on materials/processes.

Supplier and Vendor Location and Selection

He has supplier and vendor contacts and has done extensive work finding the appropriate suppliers for clients.

Other Skills and Services

His expertise includes: 32 Patents and Patent Publication; Ultra-thin wafer handling, thru-hole wafer connections; Major manufacturing cost reductions; Technical Support for Sub-contractor Quality; Joint Development Project Manager for Joint Partnership Quality at High volume manufacturing in Malaysia.


 

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