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 Expert  727044

Expert in Semiconductor Assembly and General Technology Management


Available for your Consulting and Expert Witness Needs

New York (NY)
USA
Education Work HistoryPublicationsConsulting Services Expert Witness

Summary of Expertise:

Listed with other top experts in: 

Expert has worked in Assembly Technology since 1977 at such leading companies as Intel and Orient Semiconductor. During the last 30 years, he has amassed a great deal of hands on experience with the interaction of the wafer fabrication process and its impact on the reliable assembly of a semiconductor device. He has been responsible for all plastic package reliability at Intel and has been the assembly manager at four companies, Intel, Xicor, EDI and ASI before going onto senior management positions in those companies. He is responsible for introducing novel integration processes that have and continue to generate revenues in excess of $4M. Expert has a great deal of experience in Asia where his assembly and test facilities were located. He has negotiated several advantageous business initiatives that have saved millions of dollars and improved quality and shortened lead times significantly. He has been involved with almost every aspect of packaging technology from Al corrosion to lead finish issues. It also included an extensive background in package thermal issues and exotic materials, i.e. diamond substrates. He currently writes the Assembly/Test section for IC Knowledge and has worked with a Big Consulting Company on Package Technology. In addition, Expert has spent the last 20 years working with Military supplying Hi Rel devices. He has spoken at several Marcus Evans events, concerning packaging technology to solve obsolescence issues and chaired the Military AeroSpace Summit in Florida last year.
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aerospace electronics science

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assembly engineering

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assembly sequence planning

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assembly technology

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corrosion engineering

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diamond-like carbon coating material

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electronic packaging

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electronic packaging industry

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electronic packaging technology

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electronics manufacturing management

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electronics radiation hardening

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electronics research-and-development management

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engineering change control

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engineering project management

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first level packaging

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integrated-circuit package

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ionic contamination

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metal-insulator semiconductor device

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particle filtration

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plastic encapsulated microcircuit reliability

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plastic semiconductor device package

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printed circuit board assembly process

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printed circuit board design

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printed circuit board design-for-manufacturability

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printed circuit board machine project management

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printed circuit board manufacturing

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production management

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semiconductor assembly engineering

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semiconductor defect analysis

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semiconductor device analysis

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semiconductor device failure

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semiconductor device package reliability

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semiconductor device package sealing

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semiconductor device packaging material

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semiconductor device packaging process

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semiconductor product quality assurance

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semiconductor product quality control

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semiconductor product quality management

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semiconductor quality improvement

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technology management


Show Secondary and Basic Areas of Expertise
Localities:
Expert may consult nationally and internationally, and is also local to the following cities: New York, New York;  Yonkers, New York;  Newark, New Jersey;  Jersey City, New Jersey;  Paterson, New Jersey;  Elizabeth, New Jersey;  Bridgeport, Connecticut;  New Haven, Connecticut;  Hartford, Connecticut;  and Philadelphia, Pennsylvania.

Education:
Year   Degree   Subject   Institution  
1974   MS Chemistry   Electrochemistry   Clarkson University  

Work History:
Years   Employer   Title   Responsibilities

2006 to 2009

 

Austin Semiconductor Inc.

 

President

 

He was responsible for modernizing the entire operation which was focused on military supply with grow into the high end industrial market.

2004 to 2006

 

Austin Semiconductor Inc.

 

VP of Operations

 

Directed all manufacturing activities, including production control, purchasing, in-house custom assembly and subcons in Asia. Managed staff of 10 Engineers and 30 DLs, reporting to the President. Improved productivity by 20% lowered costs by 15% and gained back customer confidence at three major accounts. Implemented new plastic modules for military market.

2002 to 2003

 

Peak International

 

Eastern Regional Sales Manager

 

Directed sales activities east of the Mississippi from Canada to Florida. Provided technical support across all geographies. Developed new sales accounts for innovative products and grew revenue by 10% in a down market.

2000 to 2002

 

OSEI

 

Sales Manager

 

Directed sales of component assembly and test services across the entire Eastern seaboard. Provided technical support to the East Coast office in all areas of assembly and test technology.


Publications:
Selected Publications and Publishers  
 - Assembly Technology International  

Consulting Services:
Recent Client Requests:
  • Expert for consulting on plastic package assembly of SOI-based integrated circuits.
  • Expert in circuit board developer for consulting on fireplace.
  • Expert in Carbon Ink Printed Circuit Boards.
Click the green button above to contact Expert for a free initial screening call regarding your expert consulting needs.  Expert is available for consulting to corporate, legal and government clients.  Remember, your initial screening call to speak with Expert is free.

Expert Witness:
Click the green button above to contact Expert for a free initial screening call regarding expert testimony, litigation consulting and support, forensic services, or any related expert witness services.  A few litigation needs include product liability, personal injury, economic loss, intellectual property (patent, trademark, trade secret, copyright), and insurance matters.  Remember, your initial screening call to speak with Expert is free.

 

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