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 Expert  727799

Expert in IC Substrate Manufacturing, Chemical Vapor Deposition, Phenomenological Thermodynamic Modeling

Available for your Consulting and Expert Witness Needs

California (CA)
Education Work History Career AccomplishmentsPublicationsConsulting Services Expert Witness Market Research

Summary of Expertise:

Listed with other top experts in: 

Expert owned the copper plating process module at Intel's Assembly Test Technology Development site for ~2 years, focusing on plating deposition process, plating solution chemistry, plating equipment and thickness uniformity control as pertaining to IC substrate manufacturing. He interfaced with plating solution and equipment suppliers, as well as substrate manufacturers, to push the state of the art for both electroless and electrolytic copper plating. His work involved selection and implementation of new unfilled and filled via plating chemstries, periodic reverse pulse plating equipment, jet plating equipment, and continuous plating equipment for panel-level plating. His work also included periodic troubleshooting of high volume manufacturing lines to resolve electrolytic plating issues, which included bubble entrapment, via delamination, and large dimple formation, as well as electroless plating issues such as incomplete via coverage, thickness non-uniformity across the panel, and foreign material induced quality issues.

copper metallizing


interconnect substrate


metal organic chemical vapor deposition


printed circuit board substrate


surface finishing process

Show Secondary and Basic Areas of Expertise
Expert may consult nationally and internationally, and is also local to the following cities: Los Angeles, California;  San Diego, California;  Long Beach, California;  Santa Ana, California;  Anaheim, California;  Riverside, California;  Glendale, California;  Huntington Beach, California;  San Bernardino, California;  and Chula Vista, California.

Year   Degree   Subject   Institution  
2004   PhD   Chemical Engineering   University of Florida  
1997   Bachelor's   Chemical Engineering   Georgia Institute of Technology  

Work History:
Years   Employer   Department   Title   Responsibilities

2008 to




Expert's Firm CDMA Technologies (QCT)


Director, Engineering


Director of Engineering leading substrate and advanced packaging teams

2004 to 2008


Intel Corporation


Assembly Test Technology Development


Senior Packaging Engineer


Packaging engineer focused on substrate module (surface finish, Cu plating, core material and buildup dielectric material selection, halogen-free conversion)

1999 to 2004


University of Florida


Department of Chemical Engineering


UF Alumni Graduate Fellow


MOCVD of thin film diffusion barriers (WNxCy), epitaxy buffer layers (BP), and high brightness electron sources (LaB6). Thermodynamic analysis of a 5-component W-N-H-C-Cl system.

1997 to 1999


Fluor Daniel


Petroleum and Petrochemicals


Associate Process Engineer II


Chemical engineer supporting design and fabrication of manufacturing plants, including DuPont acrylic resin, DuPont automotive paint, and GE polycarbonate facility expansions.

2016 to






Principal Microelectronic Packaging Engineer


Microelectronic packaging engineer developing breakthrough data-center switch technology to increase bandwidth and reduce cost.

Career Accomplishments:


Professional Appointments

-Former co-chair of iNEMI surface finish consortium -Session chair for iMAPs "Think Thin" workshop


-Invited guest lecturer to ASU's Introduction to Microelectronic Packaging Course -Invited speaker at Intel/Halogen Free Symposium

Publications and Patents Summary

He has 27 patents issued by the USPTO, and over 10 publications.

Selected Publications and Publishers  
 - 2014 Electronic Componenents Technology Conference  
 - Intel Technology Journal  
 - Journal of the American Chemical Society  
 - Journal of the Electrochemical Society  

Consulting Services:
Selected Consulting Examples:
  • He provided consulting expertise to a company building MEMS-type devices consisting of a sequential build process which suffered from a corrosion issue. Provided a detailed review of potential sources of corrosion, and proposed a corrective action plan to address the issues.
Recent Client Requests:
  • Expert in PTC Thermistor to assist with Gold Bonding and yield issues.
Click the green button above to contact Expert for a free initial screening call regarding your expert consulting needs.  Expert is available for consulting to corporate, legal and government clients.  Remember, your initial screening call to speak with Expert is free.

Expert Witness:
Click the green button above to contact Expert for a free initial screening call regarding expert testimony, litigation consulting and support, forensic services, or any related expert witness services.  A few litigation needs include product liability, personal injury, economic loss, intellectual property (patent, trademark, trade secret, copyright), and insurance matters.  Remember, your initial screening call to speak with Expert is free.

International Experience:
Years   Country / Region   Summary
2008 to 1915   Asia-Pacific   He defines the substrate technology roadmap for a Fortune 500 company, and is driving substrate manufacturing technology upgrades and implementation to production at a number of substrate manufacturing sites in Asia. He also drives assembly material selection and process improvements at a number of large asubcontractor sites in Asia.
2004 to 2008   Japan   Working with major FCBGA/FCPGA/FCLGA substrate suppliers, he drove implementation of new ENEPIG surface finish onto substrates used in HVM by a major worldwide semiconductor producer. He also drove technology development for copper plating (to improve thickness uniformity), led halogen-free substrate materials selection and implementation, and led a warpage improvement effort for said major worldwide semiconductor producer.

Language Skills:
Foreign Language   Description
French   He can speak, read and write French at an intermediate level, having studied for 4 years in high school and 1 year at University level.
Portuguese   He can speak, read and write Brazilian Portuguese at an intermediate level, having traveled substantially to Brazil from 2002 to present day.

Market Research:
I lead development of Expert's Firm's substrate roadmap, which is the model for FCCSP development in the industry. I also collaborate on Expert's Firm's overall packaging roadmap, which is a model for packaging in the mobile space. I have significant industry network, and remain apprised of key developments on regular basis.

Click the green button above to contact Expert for a free initial screening call regarding your marketing research, industry research, and company research needs.  For research needs involving multiple experts or secondary research, a Research Director can be assigned to coordinate the work into a custom report for you as a potentially quicker and more cost effective alternative to doing this work yourself or hiring a boutique consultancy.  Remember, your initial screening call to speak with Expert is free.

Additional Skills and Services:

Regularly teach a half-day class on IC substrate manufacturing at Expert's Firm. Have also taught similar class at Arizona State University as a guest lecturer.

Supplier and Vendor Location and Selection

I have significant experience in choosing, vetting, and qualifying suppliers for substrate manufacturing, MLCC capacitor manufacturing, core/prepreg manufacturing, solder resist manufacturing, and assembly manufacturing.

Other Skills and Services

I can provide consulting on substrate manufacturing yield improvements, warpage improvements, roadmapping, and assembly technology troubleshooting.


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