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ball grid array package

  

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Ball Grid Array Package Experts

The following experts are available as ball grid array package consultants and ball grid array package expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Ball Grid Array Package - An integrated circuit package which, instead of having leads protruding from the edges of the package, has rows and columns of solder "balls" on the underside of the package which are melted to form links with a circuit board. Ball grid array packages offer excellent electrical and thermal performance, small package size, and high pin counts.

Synonyms:  BGA

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Expert in Soldering Technology, Printed Circuit Boards, Intermetallic Compounds and Military Standard-2000
Expert's career has provided him with the opportunity to see and be a part of the growth of the electronics industry from vacuum tubes and terminals to transistors and printed wiring boards. His early working life was spent as lead laboratory engineer ... See full profile

Alabama (AL), USA

Expert in Surface Mount Technology
Expert has been involved with surface-mount assembly for the past 18 years. He has extensive knowledge of solder paste printing, component placement, reflow and wave soldering, cleaning, inspection, and repair. See full profile

New Hampshire (NH), USA

Expert in Food Processing, Packaging, Quality, Business Development, Cost Reduction, Warehousing and Material
Expert is a Food Processing and Packaging Consultant with active membership in the IOPP Packaging Consultants Council, SPE Consultants Circle, and Food and Beverage Industry Executive Advisory Panel Member. He has over 40 years of product, process, and ... See full profile

Florida (FL), USA

Expert in Surface Mount Solders
Expert has devoted her career to surface mount assembling since such technology was first implemented in the printed circuit industry. She is knowledgeable of all aspects of board-level in surface mount technology. She is a consultant to OEMs and SMT ... See full profile

New York (NY), USA

Expert in Electronic Components: System Reliability, and Failure Analysis
Expert notes that active electronic elements such as transistors, diodes, integrated circuits, ASICs, MMICs, hybrid microelectronic devices, and MCMs are the basis for all electronic systems. Expert's depth of knowledge ... See full profile

Arizona (AZ), USA

Expert in RFID, Operations Management, R&D Strategy, Project Management, Supply Chain & Logistics
Expert was a pioneer in the "surface mount revolution" where he developed packaging, interconnect, process, and design technologies to enable high volume, small footprint manufacturing of two-way radios, cellphones, and pagers. See full profile

California (CA), USA

 
 

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