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Related Expert Areas

  

bumped die

  

semiconductor die

 • 

semiconductor wafer dicing

 • 

wafer bumping

 • 

die bonding

 

Bumped Die Experts

The following experts are available as bumped die consultants and bumped die expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Bumped Die - A semiconductor die with raised metal features to facilitate inner-lead bonding.

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Expert in Semiconductor Market in Greater China, IC Testing Solutions and Market
Expert has been working in the semiconductor field more than 20 years, 18+ years working for IC testing related businesses as a sales professional. He has been involved in wafer testing (related Probe card, prober), through package testing and then to ... See full profile

Taiwan, Taiwan

Expert in Electronic Components: System Reliability, and Failure Analysis
Expert notes that active electronic elements such as transistors, diodes, integrated circuits, ASICs, MMICs, hybrid microelectronic devices, and MCMs are the basis for all electronic systems. Expert's depth of knowledge ... See full profile

Arizona (AZ), USA

 
 

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