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chip-to-package interconnection


tape-automated bonding


printed circuit interconnection


thin small outline package




electronic packaging technology


interconnection technology process development


interconnect substrate


flip-chip assembly


flip chip


wire bonding


lead frame


interconnection technology


Chip-To-Package Interconnection Experts

The following experts are available as chip-to-package interconnection consultants and chip-to-package interconnection expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Chip-To-Package Interconnection - A connection process to interconnect an integrated circuit chip and its package. Interconnection options include wire bond, flip chip, beam lead, and TAB. In wire-bonded packages, the back of the chip is first mechanically attached to a mounting surface, such as a lead frame. Following this, the bond pads on the circuit side of the chip are electrically interconnected to the package by wire bonding.

Synonyms:  die-to-package interconnection

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Expert in IC Substrate Manufacturing, Chemical Vapor Deposition, Phenomenological Thermodynamic Modeling
Expert owned the copper plating process module at Intel's Assembly Test Technology Development site for ~2 years, focusing on plating deposition process, plating solution chemistry, plating equipment and thickness uniformity control as pertaining to IC ... See full profile

California (CA), USA

Expert in Technical Marketing, New Product Development & Launch, Materials Physics
Heat transfer across interfaces and through particulate-filled composite materials (solids and liquids) was one of his primary areas of research while at 3M Company. His work included development of heat transfer products for use in electronic equipment ... See full profile

Minnesota (MN), USA

Expert in Electronic Components: System Reliability, and Failure Analysis
Expert notes that active electronic elements such as transistors, diodes, integrated circuits, ASICs, MMICs, hybrid microelectronic devices, and MCMs are the basis for all electronic systems. Expert's depth of knowledge ... See full profile

Arizona (AZ), USA

Expert in RFID, Operations Management, R&D Strategy, Project Management, Supply Chain & Logistics
Expert was a pioneer in the "surface mount revolution" where he developed packaging, interconnect, process, and design technologies to enable high volume, small footprint manufacturing of two-way radios, cellphones, and pagers. See full profile

California (CA), USA

Expert in Electronic Assembly, Electronic Packaging
Expert is internationally renowned in the field of fine-pitch, chip scale, wafer level, and general surface mount electronic design and assembly. He is credited with founding the first U.S. based surface mount technology (SMT) ... See full profile

California (CA), USA

Expert in Solid State Electronics, Electromagnetics
Expert has expertise in technologies, and in technology forecasting and technology management. Expert aids inventors, technologists, and high-tech start-up companies develop and position their technology assets for maximum economic benefit. See full profile

Georgia (GA), USA

Expert in Food Processing, Packaging, Quality, Business Development, Cost Reduction, Warehousing and Material
Expert is a Food Processing and Packaging Consultant with active membership in the IOPP Packaging Consultants Council, SPE Consultants Circle, and Food and Beverage Industry Executive Advisory Panel Member. He has over 40 years of product, process, and ... See full profile

Florida (FL), USA

Expert in Surface Mount Technology
Expert has been involved with surface-mount assembly for the past 18 years. He has extensive knowledge of solder paste printing, component placement, reflow and wave soldering, cleaning, inspection, and repair. See full profile

New Hampshire (NH), USA


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