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controlled collapse component connection


flip-chip assembly


ball grid array package


thermal expansion coefficient


solder ball by-product


solder wetting


flip chip


Controlled Collapse Component Connection Experts

The following experts are available as controlled collapse component connection consultants and controlled collapse component connection expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Controlled Collapse Component Connection - A process of attaching a flip chip to a substrate, developed by IBM, that makes use of solder bumps which collapse onto the chip during the soldering process.

Synonyms:  C4, C-4, controlled collapse chip connection, controlled collapse circuit connection, controlled collapse component connexion, controlled collapse soldering

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Expert in Surface Mount Technology
Expert has been involved with surface-mount assembly for the past 18 years. He has extensive knowledge of solder paste printing, component placement, reflow and wave soldering, cleaning, inspection, and repair. See full profile

New Hampshire (NH), USA

Expert in Adhesion Science, Surface Modification of Low Energy Polymers, Polar Bonding
His expertise in adhesive application comes as a result of identifying the correct adhesive for a particular joining requirement and the need to then be able to implement that solution in a production environment. He has over the years found a wide range ... See full profile

AB, Canada


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