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creep-induced solder joint failure


solder joint failure


product failure


solder joint design


surface-mount solder joint reliability


surface-mount solder joint


solder joint


surface-mount assembly


printed circuit board


surface-mount technology




Experts in Creep-Induced Solder Joint Failure

The following experts are available as creep-induced solder joint failure consultants and creep-induced solder joint failure expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Creep-Induced Solder Joint Failure - Solder joint failure that is caused by creep.

Synonyms:  solder creep

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Experts in Creep-Induced Solder Joint Failure
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Expert in Reliability Engineering, Reliability Program Management, Accelerated Testing
Expert has conducted over 80 reliability program assessments in the high tech, aerospace, oil exploration, medical device industries. Expert has made high impact recommendations and guided design and manufacturing firms to make significant improvements in ... See full profile

California (CA), USA

Expert in Electronics Design and Manufacture Reliability, Failure Analysis, Asia Manufacturer Risk Management
Expert has over 20 years of expanding responsibilities in the research and engineering of reliability risk identification, analysis, quantification and mitigation in the context of product and technology development. He is responsible for both technical ... See full profile

Washington (WA), USA

Expert in CFC Alternatives, Electronics; Circuit Board; Circuit Board Solvents; Chlorofluorocarbon
Expert was responsible for developing and evaluating new products for their ability to substitute for CFC-113 solvents in electronics defluxing and industrial cleaning applications. He directed and managed the testing of two products for the ... See full profile

California (CA), USA

Expert in Printed Wiring Board Assembly
Expert is the inventor of surface mount (SM) assembly. He has set up over 500 SM centers in the US, Europe, Australia, and Japan. He initiated SM at Motorola. Additionally, he has considerable experience auditing SM work centers so as to ... See full profile

Florida (FL), USA

Expert in Semiconductor Industry IC Package Design and Development, Consulting and Training
Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers Expert ... See full profile

California (CA), USA

Expert in RFID, Operations Management, R&D Strategy, Project Management, Supply Chain & Logistics
Expert was a pioneer in the "surface mount revolution" where he developed packaging, interconnect, process, and design technologies to enable high volume, small footprint manufacturing of two-way radios, cellphones, and pagers. See full profile

California (CA), USA

Expert in Electronic Assembly, Electronic Packaging
Expert is internationally renowned in the field of fine-pitch, chip scale, wafer level, and general surface mount electronic design and assembly. He is credited with founding the first U.S. based surface mount technology (SMT) ... See full profile

California (CA), USA

Expert in Surface Mount Technology
Expert has been involved with surface-mount assembly for the past 18 years. He has extensive knowledge of solder paste printing, component placement, reflow and wave soldering, cleaning, inspection, and repair. See full profile

New Hampshire (NH), USA


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