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Related Expert Areas


electronic component-to-substrate adhesive bonding


physical bonding


electronic shielding




electronic circuit element


Experts in Electronic Component-To-Substrate Adhesive Bonding

The following experts are available as electronic component-to-substrate adhesive bonding consultants and electronic component-to-substrate adhesive bonding expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Electronic Component-To-Substrate Adhesive Bonding - Bonding of an electronic component to a substrate.

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Experts in Electronic Component-To-Substrate Adhesive Bonding
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Expert in Adhesion Bonding, Plastic Surface Treatments, Plastics Decorating, Finishing, Coating, Laser Marking
Expert has extensive experience diagnosing adhesion problems and implementing cost effective solutions for bonding/joining like and dissimilar materials. He received a US patent for a bonding process which yields superior ... See full profile

Texas (TX), USA

Expert in Adhesives, Coatings, Materials and Process Chemistry
Expert is a professional chemist with 35+ years experience in academics, commercial, aerospace, electronics, and automotive-related industries. A hands-on consultant on various aspects of engineering materials, their applications and ... See full profile

Illinois (IL), USA

Expert in cGMP Coatings, Adhesives, Die Cutting, Security Holograms, Printing, Operations Management Metrics and Strategy, Materials
Expert has worked in custom manufacturing polymerization, mixing, coating and converting of cGMP adhesive and laminates - as a process engineering manager. In this role he lead operations and engineering on the corporate Business Strategy Team (BST) ... See full profile

Pennsylvania (PA), USA

Expert in Electronic Components: System Reliability, and Failure Analysis
Expert notes that active electronic elements such as transistors, diodes, integrated circuits, ASICs, MMICs, hybrid microelectronic devices, and MCMs are the basis for all electronic systems. Expert's depth of knowledge ... See full profile

Arizona (AZ), USA

Expert in IC Substrate Manufacturing, Chemical Vapor Deposition, Phenomenological Thermodynamic Modeling
Expert owned the copper plating process module at Intel's Assembly Test Technology Development site for ~2 years, focusing on plating deposition process, plating solution chemistry, plating equipment and thickness uniformity control as pertaining to IC ... See full profile

California (CA), USA

Expert in Adhesion Science, Surface Modification of Low Energy Polymers, Polar Bonding
His expertise in adhesive application comes as a result of identifying the correct adhesive for a particular joining requirement and the need to then be able to implement that solution in a production environment. He has over the years found a wide range ... See full profile

AB, Canada

Expert in Adhesion and Surface Properties
Expert has been involved with the theory and practical application of adhesion science for the past 30 years. He developed one of the adhesion theories--molecular bonding mechanism--and applied the hard-soft, acid-base (HSAB) principle to ... See full profile

New York (NY), USA

Expert in Fasteners
Expert offers consulting services to hardware manufacturers, distributors, and OEM users on issues related to engineering, design, application, training, and sales of threaded fasteners, lock nuts, and machined and cold-headed parts. See full profile

Illinois (IL), USA


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