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electronic package thermal impedance


physical property


Electronic Package Thermal Impedance Experts

The following experts are available as electronic package thermal impedance consultants and electronic package thermal impedance expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Electronic Package Thermal Impedance - A property indicating the thermal impedance of an electronic package.

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Expert in Electronics and Power Conversion Design, Root Cause Analysis, Nuclear NEMP and EMP Protection.
Expert has applied leadership in the electronic design industry since 1988. Designing electronics and power conversion, (AC/DC and DC/DC) for military and commercial industries, specializing in the power conversion and electronic architecture industries. See full profile

United Kingdom

Expert in RFIC, AMS and ROIC Circuit Design; IP and Patents; System Design; New Business, SBIR and Proposals
He has extensive experience in high-performance / high-dynamic range analog mixed signal, custom digital, and RF integrated circuit design, layout, and test, from concept to production for commercial, military, and space IC products. See full profile

California (CA), USA

Expert in Geomechanics and Material Testing
Expert has applied numerical methods and constitutive models for a wide range of soil-structure interaction problems. He has in-depth knowledge of rock mechanics, soil mechanics, and groundwater flow modeling. His knowledge of geotechnical engineering ... See full profile

Arizona (AZ), USA

Expert in Food Processing, Packaging, Quality, Business Development, Cost Reduction, Warehousing and Material
Expert is a Food Processing and Packaging Consultant with active membership in the IOPP Packaging Consultants Council, SPE Consultants Circle, and Food and Beverage Industry Executive Advisory Panel Member. He has over 40 years of product, process, and ... See full profile

Florida (FL), USA


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