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electronic packaging technology

  

technology

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silicone conformal coating

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electronic packaging industry

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thin small outline package

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chip-to-package interconnection

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semiconductor device packaging material

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semiconductor device package

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interconnection technology process development

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multichip module packaging process

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surface-mount technology chip carrier

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electronic interconnector

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interconnect substrate

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semiconductor device packaging process

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semiconductor die

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surface-mount technology

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lead frame

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multichip module

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interconnection technology

 

Electronic Packaging Technology Experts

The following experts are available as electronic packaging technology consultants and electronic packaging technology expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Electronic Packaging Technology - Technology related to the development and advancement of packaging for electronic devices.

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Join our distinguished experts for electronic packaging technology jobs, projects and consulting opportunities.


1 to 24
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Electronic Packaging Technology Experts
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Expert in Electronic Packaging and Materials
Expert has spent a portion of the past 10 years on improving the efficiency of multi-junction amorphous silicon solar cells. In particular, a large effort has been directed at understanding metal-induced crystallization of amorphous ... See full profile

Arkansas (AR), USA

Expert in Semiconductor Fabrication, Packaging, Laser Processing, Reliability, Fuse Redundancy
This expert has his doctorate from the world's top research university with over 25 years experience in semiconductor device fabrication and manufacturing. He has several patents related to laser processing of application specific circuitry and redundancy ... See full profile

Israel

Expert in Thermosetting Polymers, Product Development Process, New Business Development
Expert is a nationally recognized authority in thermosetting polymers. He has developed a fundamental understanding of thermosetting polymers including detailed experience in the rheology of curing systems (chemorheology), cure kinetics, physical property ... See full profile

California (CA), USA

Expert in Semiconductor Assembly and General Technology Management
Expert has worked in Assembly Technology since 1977 at such leading companies as Intel and Orient Semiconductor. During the last 30 years, he has amassed a great deal of hands on experience with the interaction of the wafer fabrication process and its ... See full profile

New York (NY), USA

Expert in Semiconductor Packaging and Assembly, Systems Engineering, and Materials Science.
Expert has designed a digital press having the lithographic performance of photo gravure, but able to stream continuous data for variable printing. The performance includes 2400 dpi resolution, 200 fpm web speed, and 48-inch wide print dimension. See full profile

California (CA), USA

Expert in Technical Marketing, New Product Development & Launch, Materials Physics
Heat transfer across interfaces and through particulate-filled composite materials (solids and liquids) was one of his primary areas of research while at 3M Company. His work included development of heat transfer products for use in electronic equipment ... See full profile

Minnesota (MN), USA

Expert in Electronic Assembly, Electronic Packaging
Expert is internationally renowned in the field of fine-pitch, chip scale, wafer level, and general surface mount electronic design and assembly. He is credited with founding the first U.S. based surface mount technology (SMT) ... See full profile

California (CA), USA

Expert in Hybrid Thick Film Circuit Layout, Low Temperature Co-fired Ceramics: Design and Manufacturing
Expert has worked in the forefront of developing technology in the area of electronic ceramics for over thirty years, ranging from the early high-alumina ceramic substrate refinement for additive and subtractive microelectronic packaging circuit ... See full profile

Maryland (MD), USA

Expert in Food Processing, Packaging, Quality, Business Development, Cost Reduction, Warehousing and Material
Expert is a Food Processing and Packaging Consultant with active membership in the IOPP Packaging Consultants Council, SPE Consultants Circle, and Food and Beverage Industry Executive Advisory Panel Member. He has over 40 years of product, process, and ... See full profile

Florida (FL), USA

Expert in RFIC, AMS and ROIC Circuit Design; IP and Patents; System Design; New Business, SBIR and Proposals
He has extensive experience in high-performance / high-dynamic range analog mixed signal, custom digital, and RF integrated circuit design, layout, and test, from concept to production for commercial, military, and space IC products. See full profile

California (CA), USA

Expert in IC Substrate Manufacturing, Chemical Vapor Deposition, Phenomenological Thermodynamic Modeling
Expert owned the copper plating process module at Intel's Assembly Test Technology Development site for ~2 years, focusing on plating deposition process, plating solution chemistry, plating equipment and thickness uniformity control as pertaining to IC ... See full profile

California (CA), USA

Expert in Electronics and Power Conversion Design, Root Cause Analysis, Nuclear NEMP and EMP Protection.
Expert has applied leadership in the electronic design industry since 1988. Designing electronics and power conversion, (AC/DC and DC/DC) for military and commercial industries, specializing in the power conversion and electronic architecture industries. See full profile

United Kingdom

Expert in Analog IC Design, Mixed-signal IC Design, Off-shore Engineering, High-Speed Interfaces
Electronics engineering professional with over twenty-five years experience. Various individual contributor, technical leadership and management roles were performed including integrated circuit and system design, engineering management, business ... See full profile

California (CA), USA

Expert in Semiconductor Equipment & Processes, Machine Vision, Laser Ablation, Control, Instrumentation
Expert managed 35 person organization covering sales, engineering, marketing, customer support, and manufacturing. He has performed market analysis, developed product specifications and ran engineering group to design wafer scanners. See full profile

Pennsylvania (PA), USA

Expert in Materials and Processes of Semiconductor Microelectronic Products
Expert has experience in semiconductor crystal growing, epitaxial, wafer processing, product engineering, wafer sorting, process control monitors, materials, equipment, quality, reliability, failure analysis, packaging and assembly, reports and great at ... See full profile

California (CA), USA

Expert in Printed Wiring Board Assembly
Expert is the inventor of surface mount (SM) assembly. He has set up over 500 SM centers in the US, Europe, Australia, and Japan. He initiated SM at Motorola. Additionally, he has considerable experience auditing SM work centers so as to ... See full profile

Florida (FL), USA

Expert in LEDs for Solid-State Lighting, LCD Optoelectronics & LED BLUs, Mono- & Poly-Crystalline PVs
Experience and knowledge runs the gamut of these technologies: from epitaxial wafers; to die fabrication and testing; to micro-electronic packaging (including photo-conversion), modular integration and assembly (includes photo-initiation, ... See full profile

California (CA), USA

Expert in Solar Photovoltaics, Solar Thermal Energy, Thin Films, Thick Films, Professional Electronics
Experienced in thermal battery design and production. Thermal batteries find application in missiles and other aero space applications. Experienced in processes and manufacturing of solar photovoltaic devices such as solar cells, solar modules. See full profile

Andhra Pradesh, India

Expert in Engineering Systems Design & Development: SAW Sensors, Cleanrooms, VLSI Technology, Photolithography
Expert began research in computational mechanics of fibre-reinforced composite materials through which he obtained his PhD. With this background, he explored other advanced materials like piezoelectrics. Piezoelectric materials are essential for the ... See full profile

Bexley, NSW, Australia

Expert in Electronic Components: System Reliability, and Failure Analysis
Expert notes that active electronic elements such as transistors, diodes, integrated circuits, ASICs, MMICs, hybrid microelectronic devices, and MCMs are the basis for all electronic systems. Expert's depth of knowledge ... See full profile

Arizona (AZ), USA

Expert in CFC Alternatives, Electronics; Circuit Board; Circuit Board Solvents; Chlorofluorocarbon
Expert was responsible for developing and evaluating new products for their ability to substitute for CFC-113 solvents in electronics defluxing and industrial cleaning applications. He directed and managed the testing of two products for the ... See full profile

California (CA), USA

Expert in Surface Mount Solders
Expert has devoted her career to surface mount assembling since such technology was first implemented in the printed circuit industry. She is knowledgeable of all aspects of board-level in surface mount technology. She is a consultant to OEMs and SMT ... See full profile

New York (NY), USA

Expert in Power Semiconductor Devices
Expert has spent a significant portion of his career in the design, fabrication, and application of power transistors. He is an expert in the reliability aspects of power transistors. He teaches a graduate-level course in ... See full profile

Arkansas (AR), USA

Expert in Printer & Digital Imaging Technology, Laser & Inkjet Product Development and Competitive Analysis
He has performed numerous head-to-head evaluations of printer products involving hands-on operation. This included evaluation of all important product features related to performance, print quality, and cost of operation (including ISO test methods). See full profile

Alabama (AL), USA

 
 

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