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Related Expert Areas


electroplating through-hole mass transfer


mass transfer


multilayer printed circuit board manufacturing


plated through-hole technology


multilayer printed circuit board


copper electroplating process


copper corrosion




Experts in Electroplating Through-Hole Mass Transfer

The following experts are available as electroplating through-hole mass transfer consultants and electroplating through-hole mass transfer expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Electroplating Through-Hole Mass Transfer - The mass transfer of copper in the through-holes of a multi-layered printed circuit board during the electroplating process of its manufacture.

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Expert in R&D Chemist experienced in epoxies, amines, benzoxazines, cyanate esters, bismaleimides, polyimides
Expert is a retired Lab Manager with more than 20 years of experience in technical service support and research & development. He is technical expert with strong chemistry, polymer science, composite, electronics, adhesives, coating, and chemical ... See full profile

Texas (TX), USA

Expert in Printed Wiring Board Assembly
Expert is the inventor of surface mount (SM) assembly. He has set up over 500 SM centers in the US, Europe, Australia, and Japan. He initiated SM at Motorola. Additionally, he has considerable experience auditing SM work centers so as to ... See full profile

Florida (FL), USA

Expert in Electroplating; Electroforming: Electroless plating; cleanliness testing; surface engineering;
Expert has a long-term interest in development & application of low-cost methods for surface cleanliness testing & assessment, both in filming & particulate contamination. In particular, use of low-cost and/or consumer electronics products for this ... See full profile

Herts, United Kingdom

Expert in Automobile, Design Eng, AutoCAD Inventor, Pro E, Noise & Vibration, Matlab, Heat Transfer, PLM
Expert has done basic and advance course on applied mathematics with very good grades in his engineering. He implemented his applied mathematics knowledge in engineering & educational purpose. Due to the necessity of applied mathematics's good knowledge ... See full profile

U.P, India

Expert in Technical Marketing, New Product Development & Launch, Materials Physics
Heat transfer across interfaces and through particulate-filled composite materials (solids and liquids) was one of his primary areas of research while at 3M Company. His work included development of heat transfer products for use in electronic equipment ... See full profile

Minnesota (MN), USA

Expert in Semiconductor Industry IC Package Design and Development, Consulting and Training
Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers Expert ... See full profile

California (CA), USA


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