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flip-chip assembly




controlled collapse component connection


anisotropic adhesive


chip-to-package interconnection


direct chip attaching


flip chip


Flip-Chip Assembly Experts

The following experts are available as flip-chip assembly consultants and flip-chip assembly expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Flip-Chip Assembly - Assembly of a flip chip in which the flip chip is face-bonded to a substrate through raised bumps, either solder or precious metal.

Synonyms:  flip bonding

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Expert in Technical Marketing, New Product Development & Launch, Materials Physics
Heat transfer across interfaces and through particulate-filled composite materials (solids and liquids) was one of his primary areas of research while at 3M Company. His work included development of heat transfer products for use in electronic equipment ... See full profile

Minnesota (MN), USA

Expert in Soldering Technology, Printed Circuit Boards, Intermetallic Compounds and Military Standard-2000
Expert's career has provided him with the opportunity to see and be a part of the growth of the electronics industry from vacuum tubes and terminals to transistors and printed wiring boards. His early working life was spent as lead laboratory engineer ... See full profile

Alabama (AL), USA


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