ORC Expert Advisory Services ORC International

  home    |    find an expert    |    request an expert    |    join our network    |    about us     expert login  
Expert Consulting and Expert Witness Services
  search tips 
Share this page:  Send to LinkedIn Send to Facebook Tweet This Email Print

Related Expert Areas


flip-chip assembly




controlled collapse component connection


anisotropic adhesive


chip-to-package interconnection


direct chip attaching


flip chip


Flip-Chip Assembly Experts

The following experts are available as flip-chip assembly consultants and flip-chip assembly expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Flip-Chip Assembly - Assembly of a flip chip in which the flip chip is face-bonded to a substrate through raised bumps, either solder or precious metal.

Synonyms:  flip bonding

Experts Only

Join our distinguished experts for flip-chip assembly jobs, projects and consulting opportunities.

1 to 1
(of 1)
Flip-Chip Assembly Experts
Request Free
Expert Quote

Expert in Product Management, Technical Marketing, New Product Development & Launch. Formerly: Materials Physics
Heat transfer across interfaces and through particulate-filled composite materials (solids and liquids) was one of his primary areas of research while at 3M Company. His work included development of heat transfer products for use in electronic equipment ... See full profile

Minnesota (MN), USA


Need the right expert in flip-chip assembly?  We can help!

home       find an expert       request an expert       join our network       about us

Intota is now ORC Expert Advisory Services