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Interconnect Substrate Experts

The following experts are available as interconnect substrate consultants and interconnect substrate expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Interconnect Substrate - A surface substrate, often made of thick or thin film, used to form the interconnectors between electronic circuit elements in an electronic integrated circuit.

Synonyms:  interconnection substrate

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Interconnect Substrate Experts
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Expert in Thermosetting Polymers, Product Development Process, New Business Development
Expert is a nationally recognized authority in thermosetting polymers. He has developed a fundamental understanding of thermosetting polymers including detailed experience in the rheology of curing systems (chemorheology), cure kinetics, physical property ... See full profile

California (CA), USA

Expert in IC Substrate Manufacturing, Chemical Vapor Deposition, Phenomenological Thermodynamic Modeling
Expert owned the copper plating process module at Intel's Assembly Test Technology Development site for ~2 years, focusing on plating deposition process, plating solution chemistry, plating equipment and thickness uniformity control as pertaining to IC ... See full profile

California (CA), USA

Expert in Surface Technology, Coatings, Thin Film Deposition, PVD, Physical Vapour Deposition, Sputtering, PLD
He studied materials science with a focus on thin film materials, focussing in his PhD on process equipment and design of room-temperature deposited coating. As post-doc, he was employed to scale up deposition process from laboratory to industrially ... See full profile

Austria

Expert in Technical Marketing, New Product Development & Launch, Materials Physics
Heat transfer across interfaces and through particulate-filled composite materials (solids and liquids) was one of his primary areas of research while at 3M Company. His work included development of heat transfer products for use in electronic equipment ... See full profile

Minnesota (MN), USA

Expert in Electronic Assembly, Electronic Packaging
Expert is internationally renowned in the field of fine-pitch, chip scale, wafer level, and general surface mount electronic design and assembly. He is credited with founding the first U.S. based surface mount technology (SMT) ... See full profile

California (CA), USA

Expert in Electrical Connectors
Expert has applied his physics background to generate a fundamental understanding of temperature generation and material transport in electrical contact spots (a-spots) in bulk electrical interfaces. Over 25 years, his research showed that 1) Sintering ... See full profile

Canada

 
 

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