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Related Expert Areas


interconnection technology process development


process development


electronic packaging technology


chip-to-package interconnection


plasma etching technology process development


semiconductor technology


interconnect substrate




interconnection cabling


interconnection technology


Interconnection Technology Process Development Experts

The following experts are available as interconnection technology process development consultants and interconnection technology process development expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Interconnection Technology Process Development - The process development of interconnection technology.

Synonyms:  interconnect technology process development

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Interconnection Technology Process Development Experts
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Expert in Semiconductor Devices, Testing and Product Engineering, Marketing and Administration
Expert has spent most of his career in the semiconductor device and process technology areas. His experience is wide, with exposure to germanium and silicon discrete to large scale silicon integrated devices in the sub-micron regime. See full profile

California (CA), USA

Expert in IC Substrate Manufacturing, Chemical Vapor Deposition, Phenomenological Thermodynamic Modeling
Expert owned the copper plating process module at Intel's Assembly Test Technology Development site for ~2 years, focusing on plating deposition process, plating solution chemistry, plating equipment and thickness uniformity control as pertaining to IC ... See full profile

California (CA), USA

Expert in Technical Marketing, New Product Development & Launch, Materials Physics
Heat transfer across interfaces and through particulate-filled composite materials (solids and liquids) was one of his primary areas of research while at 3M Company. His work included development of heat transfer products for use in electronic equipment ... See full profile

Minnesota (MN), USA

Expert in Electronic Assembly, Electronic Packaging
Expert is internationally renowned in the field of fine-pitch, chip scale, wafer level, and general surface mount electronic design and assembly. He is credited with founding the first U.S. based surface mount technology (SMT) ... See full profile

California (CA), USA

Expert in Electrical Connector Design and Materials, Electrical connector failure analysis, Forensic support
Electric contact; electrical connector design. Expert has extensive experience studying metals and metal surfaces related to electrical conduction processes and how they occur in bulk and across interfaces. See full profile

Pennsylvania (PA), USA


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