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low-temperature cofire ceramic technology


ceramic technology


low-temperature cofired ceramic


high-temperature cofire ceramic technology


electronic interconnector


cofired multilayer ceramic packaging material


multichip module


Experts in Low-Temperature Cofire Ceramic Technology

The following experts are available as low-temperature cofire ceramic technology consultants and low-temperature cofire ceramic technology expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Low-Temperature Cofire Ceramic Technology - The technology of making cofired multilayer ceramic packaging at relatively lower temperatures. It includes the printing of conductors on and through "green" or unfired ceramic sheets which are then stacked and laminated togeter. They are then sintered as a monolith at temperatures of around 850 degrees Celsius. Materials used are glass-ceramics, gold, silver, and copper cermets.

Synonyms:  LTCC technology

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Experts in Low-Temperature Cofire Ceramic Technology
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Expert in Low Temperature Cofired Ceramic, Microsystems manufacturing, Six Sigma, Lean & Process Engineering
An accomplished professional that has increased yields to well over 90% and reduced flow times by over 75%. Developed new processes and products that have generated new customers and millions in sales. These new processes and products have generated 3 ... See full profile

New Mexico (NM), USA

Expert in Energy Storage, Lithium & Sodium Battery, Fuel Cells, Alternative Energy, Cleantech, Solar, Hydrogen
Expert is the founder & CEO of a company which offers Cleantech related expertise & advisory services both in USA & in India to investors and companies. Clients include PE firms with over US $500 MM of assets under management, publicly listed companies on ... See full profile

Utah (UT), USA

Expert in LEDs for Solid-State Lighting, LCD Optoelectronics & LED BLUs, Mono- & Poly-Crystalline PVs
Experience and knowledge runs the gamut of these technologies: from epitaxial wafers; to die fabrication and testing; to micro-electronic packaging (including photo-conversion), modular integration and assembly (includes photo-initiation, ... See full profile

California (CA), USA

Expert in Electronic Assembly, Electronic Packaging
Expert is internationally renowned in the field of fine-pitch, chip scale, wafer level, and general surface mount electronic design and assembly. He is credited with founding the first U.S. based surface mount technology (SMT) ... See full profile

California (CA), USA


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