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Multichip Module Packaging Process Experts

The following experts are available as multichip module packaging process consultants and multichip module packaging process expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Multichip Module Packaging Process - The packaging process of a multichip module.

Synonyms:  MCM packaging process

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Expert in Semiconductor Industry IC Package Design and Development, Consulting and Training
Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers Expert ... See full profile

California (CA), USA

Expert in Electronic Packaging and Materials
Expert has spent a portion of the past 10 years on improving the efficiency of multi-junction amorphous silicon solar cells. In particular, a large effort has been directed at understanding metal-induced crystallization of amorphous ... See full profile

Arkansas (AR), USA

Expert in Food Processing, Packaging, Quality, Business Development, Cost Reduction, Warehousing and Material
Expert is a Food Processing and Packaging Consultant with active membership in the IOPP Packaging Consultants Council, SPE Consultants Circle, and Food and Beverage Industry Executive Advisory Panel Member. He has over 40 years of product, process, and ... See full profile

Florida (FL), USA

Expert in Materials, Processes and Hermeticity Testing of Microelectronics for Aerospace and Medical Implants
He has demonstrated expertise in hermetic sealing and leak testing processes for cavity style packaged microcircuits intended for high reliability military, aerospace and Class III medical implants. He has worked as a hermeticity consultant for prominent ... See full profile

Pennsylvania (PA), USA

Expert in Electronic Assembly, Electronic Packaging
Expert is internationally renowned in the field of fine-pitch, chip scale, wafer level, and general surface mount electronic design and assembly. He is credited with founding the first U.S. based surface mount technology (SMT) ... See full profile

California (CA), USA

Expert in Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis
Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use ... See full profile

Maryland (MD), USA

Expert in Surface Mount Technology
Expert has been involved with surface-mount assembly for the past 18 years. He has extensive knowledge of solder paste printing, component placement, reflow and wave soldering, cleaning, inspection, and repair. See full profile

Tennessee (TN), USA

Expert in Paper Industry, Paper-based Packaging Industry
Expert has helped numerous clients identify and develop new busienss opportunities through his strategic focus on growth consulting Expert has completed numerous competitve analysis across many industry segments for clients interested in assessing the ... See full profile

Georgia (GA), USA

Expert in Packaging Development, Microwave Heating Packages and Products, Food Product Development
Expert has 20+ years of utilizing Packaging materials to innovate around active packaging in Microwave solutions or packaging materials that have O2 scavenger or UV light technology. Expert has 20+ years of designing corrugate for the packaging ... See full profile

Minnesota (MN), USA

Expert in Materials for Electronic Applications
Expert has successfully writen 2 proposals for EPA SBIR grants. The first was for a phase 1 program for the recovery and regeneration of spent etchants. This successful program was followed by a phase 2 proposal and award. That phase 2 program is in ... See full profile

California (CA), USA

 
 

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