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Related Expert Areas


plastic encapsulated microcircuit reliability




stress testing


plastic semiconductor device package


microelectronic circuit


semiconductor device


plastic package




Plastic Encapsulated Microcircuit Reliability Experts

The following experts are available as plastic encapsulated microcircuit reliability consultants and plastic encapsulated microcircuit reliability expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Plastic Encapsulated Microcircuit Reliability - Reliability of semiconductor devices that are packaged in plastic.

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Plastic Encapsulated Microcircuit Reliability Experts
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Expert in Semiconductor Assembly and General Technology Management
Expert has worked in Assembly Technology since 1977 at such leading companies as Intel and Orient Semiconductor. During the last 30 years, he has amassed a great deal of hands on experience with the interaction of the wafer fabrication process and its ... See full profile

New York (NY), USA

Expert in Electronic Reliability & On-Chip ESD Protection
Expert currently works on predicting the electric breakdown of silicon dioxide gate dielectric. He is knowledgeable of the electric breakdown characteristics of silicon and air. Additionally, he has studied the effects of ... See full profile

Arizona (AZ), USA

Expert in Reliability Engineering, Reliability Program Management, Accelerated Testing
Expert has conducted over 80 reliability program assessments in the high tech, aerospace, oil exploration, medical device industries. Expert has made high impact recommendations and guided design and manufacturing firms to make significant improvements in ... See full profile

California (CA), USA

Expert in Electronics Design and Manufacture Reliability, Failure Analysis, Asia Manufacturer Risk Management
Expert has over 20 years of expanding responsibilities in the research and engineering of reliability risk identification, analysis, quantification and mitigation in the context of product and technology development. He is responsible for both technical ... See full profile

Washington (WA), USA

Expert in Electronics Reliability and Testing, Electronics Packaging Semiconductor Packaging, Patent Analysis
Expert has worked under sponsorship from the US Air Force on the development of integrated circuit, hybrid, and multichip module package design guidelines, focusing on reliability, to enable the design of packages for specific end-use ... See full profile

Maryland (MD), USA


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