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printed circuit board corrosion failure analysis


corrosion failure analysis


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printed circuit board stress analysis


printed circuit board soldering


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Experts in Printed Circuit Board Corrosion Failure Analysis

The following experts are available as printed circuit board corrosion failure analysis consultants and printed circuit board corrosion failure analysis expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Printed Circuit Board Corrosion Failure Analysis - The process of failure analysis applied to printed circuit boards to determine the cause of failure due to corrosion.

Synonyms:  PC board corrosion failure analysis, PCB corrosion failure analysis

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Experts in Printed Circuit Board Corrosion Failure Analysis
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Expert in Semiconductor Yield, Metal & Material Failure Analysis, Comprehensive Root Cause Analysis
Expert has performed over 200 failure analysis reports on semiconductor integrated circuit failures, metal component failures and machinery failures. Expert has the abilities to go deep in engineering and science and obtain the most likely root ... See full profile

Minnesota (MN), USA

Expert in Solar, Photovoltaic, Factory Audit, Quality Inspection, Failure Analysis, Mechanical Test
Expert has assisted various clients, including Dell, Apple, Honeywell, S.C. Johnson, P&G etc, to improve product quality and optimizing supplier quality management practices. Expert has received the ISO 9001 Lead Auditor Training and he has ... See full profile

Zhejiang, China

Expert in Soldering Technology, Printed Circuit Boards, Intermetallic Compounds and Military Standard-2000
Expert's career has provided him with the opportunity to see and be a part of the growth of the electronics industry from vacuum tubes and terminals to transistors and printed wiring boards. His early working life was spent as lead laboratory engineer ... See full profile

Alabama (AL), USA

Expert in Printed Wiring Board Assembly
Expert is the inventor of surface mount (SM) assembly. He has set up over 500 SM centers in the US, Europe, Australia, and Japan. He initiated SM at Motorola. Additionally, he has considerable experience auditing SM work centers so as to ... See full profile

Florida (FL), USA

Expert in Semiconductor Industry IC Package Design and Development, Consulting and Training
Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers Expert ... See full profile

California (CA), USA

Expert in Materials for Electronic Applications
Expert has successfully writen 2 proposals for EPA SBIR grants. The first was for a phase 1 program for the recovery and regeneration of spent etchants. This successful program was followed by a phase 2 proposal and award. That phase 2 program is in ... See full profile

California (CA), USA


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