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Related Expert Areas

  

printed circuit board manufacture waste treatment

  

industrial waste treatment

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environmentally-friendly process changes in printed circuit manufacturing

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printed circuit board manufacturing equipment

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printed circuit board cleaning

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printed circuit board

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1,4-dioxane

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ammonia

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formaldehyde

 

Experts in Printed Circuit Board Manufacture Waste Treatment

The following experts are available as printed circuit board manufacture waste treatment consultants and printed circuit board manufacture waste treatment expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Printed Circuit Board Manufacture Waste Treatment - Industrial waste treatment of chemicals used in the manufacture of printed circuits boards, such as formaldehyde, thiourea, ammonia, and glycol ethers.

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Expert in Environmental and Process Equipment Use and Liability; OSHA Violations; Metal Fabrication; and Electronics Mining and Manufacturing Operations
Expert has applied his background in chemical engineering to the area of pollution prevention across a wide range of industries. Typical scope of work and deliverables for a resource recovery to reduce expenses for a client: Case Study: A potential client ... See full profile

Massachusetts (MA), USA

Expert in Materials for Electronic Applications
Expert has successfully writen 2 proposals for EPA SBIR grants. The first was for a phase 1 program for the recovery and regeneration of spent etchants. This successful program was followed by a phase 2 proposal and award. That phase 2 program is in ... See full profile

California (CA), USA

Expert in Wastewater & Permits, Electro/Electroless/Semiconductor Plating Processes, Water Recycle
Expert has 25 years of R&D, technical service, and consulting experience in most areas of electroless plating, electrolytic plating, and printed circuit board plating. He owns his own consulting and contract R&D firm, which has ... See full profile

California (CA), USA

Expert in Semiconductor Industry IC Package Design and Development, Consulting and Training
Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers Expert ... See full profile

California (CA), USA

Expert in Printed Wiring Board Assembly
Expert is the inventor of surface mount (SM) assembly. He has set up over 500 SM centers in the US, Europe, Australia, and Japan. He initiated SM at Motorola. Additionally, he has considerable experience auditing SM work centers so as to ... See full profile

Florida (FL), USA

 
 

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