ORC Expert Advisory Services ORC International

  home    |    find an expert    |    request an expert    |    join our network    |    about us     expert login  
Expert Consulting and Expert Witness Services
  
  search tips 
Share this page:  Send to LinkedIn Send to Facebook Tweet This Email Print




Related Expert Areas

  

printed wiring assembly

  

electronic assembled device

 • 

printed wiring assembly cleaning

 • 

printed-wiring board assembly process

 • 

printed-wiring board

 • 

surface mount technology conformal coating

 • 

silicone conformal coating

 • 

parylene conformal coating

 • 

printed-wiring board drilling

 • 

solder flux removal

 • 

printed-wiring board solderability

 • 

component lead solderability

 • 

through-hole technology

 • 

printed-wiring board fabrication

 • 

solderability

 • 

chlorofluorocarbon substitute

 • 

printed circuit board soldering

 • 

printed circuit board manufacturing

 • 

printed circuit board cleaning

 • 

printed circuit board assembly process

 • 

printed circuit board

 • 

printed circuit

 • 

surface-mount technology

 • 

through-hole printed circuit assembly

 • 

conformal coating material

>> More Expert Areas
 

Printed Wiring Assembly Experts

The following experts are available as printed wiring assembly consultants and printed wiring assembly expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Printed Wiring Assembly - A device consisting of a printed wiring board upon which various components have been attached, such as resistors, transistors, and the like.

Synonyms:  PWA

Experts Only

Join our distinguished experts for printed wiring assembly jobs, projects and consulting opportunities.


1 to 13
(of 13)
Printed Wiring Assembly Experts
Request Free
Expert Quote

Expert in CFC Alternatives, Electronics; Circuit Board; Circuit Board Solvents; Chlorofluorocarbon
Expert was responsible for developing and evaluating new products for their ability to substitute for CFC-113 solvents in electronics defluxing and industrial cleaning applications. He directed and managed the testing of two products for the ... See full profile

California (CA), USA

Expert in Surface Mount Technology
Expert has been involved with surface-mount assembly for the past 18 years. He has extensive knowledge of solder paste printing, component placement, reflow and wave soldering, cleaning, inspection, and repair. See full profile

New Hampshire (NH), USA

Expert in R&D Chemist experienced in epoxies, amines, benzoxazines, cyanate esters, bismaleimides, polyimides
Expert is a retired Lab Manager with more than 20 years of experience in technical service support and research & development. He is technical expert with strong chemistry, polymer science, composite, electronics, adhesives, coating, and chemical ... See full profile

Texas (TX), USA

Expert in Power Electronics, Analog and Mixed Signal Circuit, Inverter Design, PCB Layout, Motor Control
He has obtained MSEE degree with an emphasis on power electronics where he was worked on company sponsored academic research and development activities while pursuing graduate degree. He has been designing dc-link converters, full-wave rectifiers and ... See full profile

Massachusetts (MA), USA

Expert in Materials for Electronic Applications
Expert has successfully writen 2 proposals for EPA SBIR grants. The first was for a phase 1 program for the recovery and regeneration of spent etchants. This successful program was followed by a phase 2 proposal and award. That phase 2 program is in ... See full profile

California (CA), USA

Expert in Soldering Technology, Printed Circuit Boards, Intermetallic Compounds and Military Standard-2000
Expert's career has provided him with the opportunity to see and be a part of the growth of the electronics industry from vacuum tubes and terminals to transistors and printed wiring boards. His early working life was spent as lead laboratory engineer ... See full profile

Alabama (AL), USA

Expert in Electronic Assembly, Electronic Packaging
Expert is internationally renowned in the field of fine-pitch, chip scale, wafer level, and general surface mount electronic design and assembly. He is credited with founding the first U.S. based surface mount technology (SMT) ... See full profile

California (CA), USA

Expert in Design for Test, Test Strategy, SMT Mfg, High-Speed Dig Design & PCB Layout, EMI/EMC, Digital Design
Expert has over thirty year's experience in the design, manufacturing, and test areas. His initial education was in Industrial Engineering (IE) and Business Administration. After receiving his BSEE/MSEE, where he majored in digital design, ... See full profile

Washington (WA), USA

Expert in Printed Wiring Board Assembly
Expert is the inventor of surface mount (SM) assembly. He has set up over 500 SM centers in the US, Europe, Australia, and Japan. He initiated SM at Motorola. Additionally, he has considerable experience auditing SM work centers so as to ... See full profile

Florida (FL), USA

Expert in Pulsed Power, High Voltage, and Power Electronics
Expert has over 30 years of industrial pulsed power experience working on a variety of pulse generators/power systems and rep-rated modulators to deliver high voltages (kV and MV levels) and high average power levels (kW to MW). See full profile

California (CA), USA

Expert in RF, Wireless, Microwave, Analog, Digital and Video System and Design Engineering
Expert is an RF/Microwave Engineering Consultant with 33 years of experience in the areas of RF, Microwave, Wireless, Analog, and high-speed Digital/FPGA designs. Expert recently completed a Patent Research project on an ITC Section 337 lawsuit that ... See full profile

California (CA), USA

Expert in Technical Marketing, New Product Development & Launch, Materials Physics
Heat transfer across interfaces and through particulate-filled composite materials (solids and liquids) was one of his primary areas of research while at 3M Company. His work included development of heat transfer products for use in electronic equipment ... See full profile

Minnesota (MN), USA

Expert in Semiconductor Industry IC Package Design and Development, Consulting and Training
Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers Expert ... See full profile

California (CA), USA

 
 

Need the right expert in printed wiring assembly?  We can help!

home       find an expert       request an expert       join our network       about us

Intota is now ORC Expert Advisory Services

FOLLOW ORC ON