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controlled collapse component connection


solder property


solder ball by-product


solder behavior


solder joint failure


solder joint reliability


flip-chip assembly


soldering material




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Expert in Semiconductor Technology and Microelectronics
Expert has microelectronics development, fabrication, manufacturing and intellectual property expertise acquired over a successful hands-on career spanning more than 3 decades, and covering CMOS semiconductor device technology nodes from 1um down to 14nm ... See full profile

Vermont (VT), USA

Expert in IC Substrate Manufacturing, Chemical Vapor Deposition, Phenomenological Thermodynamic Modeling
Expert owned the copper plating process module at Intel's Assembly Test Technology Development site for ~2 years, focusing on plating deposition process, plating solution chemistry, plating equipment and thickness uniformity control as pertaining to IC ... See full profile

California (CA), USA


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