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surface-mount assembly reliability




surface-mount printed circuit board


surface-mount assembly workmanship standard


surface-mount assembly


surface-mount cleaning


surface-mount technology


Surface-Mount Assembly Reliability Experts

The following experts are available as surface-mount assembly reliability consultants and surface-mount assembly reliability expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Surface-Mount Assembly Reliability - Reliability of a surface-mount assembly.

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Join our distinguished experts for surface-mount assembly reliability jobs, projects and consulting opportunities.

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Surface-Mount Assembly Reliability Experts
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Expert in Reliability Engineering, Reliability Program Management, Accelerated Testing
Expert has conducted over 80 reliability program assessments in the high tech, aerospace, oil exploration, medical device industries. Expert has made high impact recommendations and guided design and manufacturing firms to make significant improvements in ... See full profile

California (CA), USA

Expert in Electronics Design and Manufacture Reliability, Failure Analysis, Asia Manufacturer Risk Management
Expert has over 20 years of expanding responsibilities in the research and engineering of reliability risk identification, analysis, quantification and mitigation in the context of product and technology development. He is responsible for both technical ... See full profile

Washington (WA), USA

Expert in Surface Mount Technology
Expert has been involved with surface-mount assembly for the past 18 years. He has extensive knowledge of solder paste printing, component placement, reflow and wave soldering, cleaning, inspection, and repair. See full profile

New Hampshire (NH), USA

Expert in Semiconductor Industry IC Package Design and Development, Consulting and Training
Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers Expert ... See full profile

California (CA), USA


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