ORC Expert Advisory Services ORC International

  home    |    find an expert    |    request an expert    |    join our network    |    about us     expert login  
Expert Consulting and Expert Witness Services
  
  search tips 
Share this page:  Send to LinkedIn Send to Facebook Tweet This Email Print




Related Expert Areas

  

tape-automated bonding

  

chip-to-package interconnection

  

wire bonding

 • 

wafer bumping

 • 

small outline integrated circuit

 • 

ball grid array package

 • 

bond strength

 • 

chip carrier

 • 

die (device)

 • 

semiconductor device packaging process

 • 

etching

 • 

semiconductor die

 • 

photolithography

 • 

lead bonding

 • 

die bonding

 • 

fabrication

 

Tape-Automated Bonding Experts

The following experts are available as tape-automated bonding consultants and tape-automated bonding expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Tape-Automated Bonding - An automated wire-bonding process to attach integrated circuits to a substrate using interconnections supported by an organic film or tape.

Synonyms:  TAB

Experts Only

Join our distinguished experts for tape-automated bonding jobs, projects and consulting opportunities.


1 to 10
(of 10)
Tape-Automated Bonding Experts
Request Free
Expert Quote

Expert in Flexible Circuits
For the past 25 years Expert has designed, manufactured and marketed flexible circuits and flexible circuit assemblies. Expert's current position is as a consultant in both the design and marketing of flexible circuits. See full profile

Minnesota (MN), USA

Expert in Web Development, Database Driven Wrb Applications dDvelopment, Yahoo! Stores and Ecommerce Solutions
Expert has spent the past 20 years in engineering of surface mount technology (SMT) and hybrid microelectronics. He has concentrated on automated assembly and design for manufacturability. He founded AMTI (The Advanced ... See full profile

Massachusetts (MA), USA

Expert in Robotic Electronics Assembly
Expert has devoted a significant portion of his career to solving automated process problems. He has applied his expertise to a variety of industries. Much of his work has involved solving electronic processes and ... See full profile

Minnesota (MN), USA

Expert in Materials, Formulations, Coatings & Process Research & Development
Expert has 36 years experience in coating, material, formulation, and process research & development. He has commercialized formulations for the first large capacity optical recording media, the Kodak 68100 LWR media. His novel and patented organic ... See full profile

New York (NY), USA

Expert in Printed Wiring Board Assembly
Expert is the inventor of surface mount (SM) assembly. He has set up over 500 SM centers in the US, Europe, Australia, and Japan. He initiated SM at Motorola. Additionally, he has considerable experience auditing SM work centers so as to ... See full profile

Florida (FL), USA

Expert in Surface Mount Technology
Expert has been involved with surface-mount assembly for the past 18 years. He has extensive knowledge of solder paste printing, component placement, reflow and wave soldering, cleaning, inspection, and repair. See full profile

New Hampshire (NH), USA

Expert in Semiconductor Wafer and Packaging Materials, Process, Equipment & Quality
Semiconductor Manufacturing Processes and Control Electronic Assembly and packaging Project / Program Management Metallurgical Engineering & ... See full profile

Arizona (AZ), USA

Expert in Semiconductor Devices, Testing and Product Engineering, Marketing and Administration
Expert has spent most of his career in the semiconductor device and process technology areas. His experience is wide, with exposure to germanium and silicon discrete to large scale silicon integrated devices in the sub-micron regime. See full profile

California (CA), USA

Expert in Surface Mount Technology (SMT) and High-Technology Light Sources, Turnkey Operations, etc.
Expert has devoted a significant portion of his career to the development of Surface Mount Technology (SMT) devices, equipment, and processes. These include: placement, cleaning, solder reflow equipment, components, component design, ... See full profile

New York (NY), USA

Expert in Materials and Processes of Semiconductor Microelectronic Products
Expert has experience in semiconductor crystal growing, epitaxial, wafer processing, product engineering, wafer sorting, process control monitors, materials, equipment, quality, reliability, failure analysis, packaging and assembly, reports and great at ... See full profile

California (CA), USA

 
 

Need the right expert in tape-automated bonding?  We can help!

home       find an expert       request an expert       join our network       about us

Intota is now ORC Expert Advisory Services

FOLLOW ORC ON