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thin small outline package


integrated-circuit package


chip scale package


small outline integrated circuit


electronic packaging technology


chip-to-package interconnection


electronic packaging


multichip module packaging process


semiconductor device packaging process


Thin Small Outline Package Experts

The following experts are available as thin small outline package consultants and thin small outline package expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Thin Small Outline Package - An integrated circuit package characterized by its thin size. Typical thickness is 1.27 millimeters, with a weight of only 0.33 grams.

Synonyms:  TSOP

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Expert in Product Management, Technical Marketing, New Product Development & Launch. Formerly: Materials Physics
Heat transfer across interfaces and through particulate-filled composite materials (solids and liquids) was one of his primary areas of research while at 3M Company. His work included development of heat transfer products for use in electronic equipment ... See full profile

Minnesota (MN), USA

Expert in Surface Mount Technology (SMT) and High-Technology Light Sources, Turnkey Operations, etc.
Expert has devoted a significant portion of his career to the development of Surface Mount Technology (SMT) devices, equipment, and processes. These include: placement, cleaning, solder reflow equipment, components, component design, ... See full profile

New York (NY), USA


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