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thin small outline package

  

integrated-circuit package

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chip scale package

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small outline integrated circuit

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electronic packaging technology

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chip-to-package interconnection

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electronic packaging

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multichip module packaging process

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semiconductor device packaging process

 

Thin Small Outline Package Experts

The following experts are available as thin small outline package consultants and thin small outline package expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Thin Small Outline Package - An integrated circuit package characterized by its thin size. Typical thickness is 1.27 millimeters, with a weight of only 0.33 grams.

Synonyms:  TSOP

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Expert in Product Management, New Product Development & Launch
He has extensive experience working directly with customers and channels (both B-C and B-B) to gather Voice of the Customer and drive to understand underlying needs that can be solved with product. Pragmatic Marketing Certification. See full profile

Minnesota (MN), USA

Expert in Surface Mount Technology (SMT) and High-Technology Light Sources, Turnkey Operations, etc.
Expert has devoted a significant portion of his career to the development of Surface Mount Technology (SMT) devices, equipment, and processes. These include: placement, cleaning, solder reflow equipment, components, component design, ... See full profile

New York (NY), USA

 
 

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