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Related Expert Areas

  

through-hole technology

  

technology

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plated through-hole technology

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plated through-hole via

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through-hole plating process

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through-hole printed circuit assembly

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pink ring minimization

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pink ring

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printed wiring assembly

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telecommunications electronics science

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vapor-phase reflow soldering

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reflow soldering

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printed-wiring board assembly process

 • 

electroplating through-hole mass transfer

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printed-wiring board plating process

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through-hole flow soldering

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printed circuit board design

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printed-wiring board

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printed circuit board manufacturing

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printed circuit board assembly process

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printed circuit board

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surface-mount technology

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interconnection technology

 

Through-Hole Technology Experts

The following experts are available as through-hole technology consultants and through-hole technology expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Through-Hole Technology - Technology involving the assembly of electronic circuits through holes in a circuit board.

Synonyms:  THT

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Join our distinguished experts for through-hole technology jobs, projects and consulting opportunities.


1 to 7
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Through-Hole Technology Experts
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Expert in Power Electronics, Analog and Mixed Signal Circuit, Inverter Design, PCB Layout, Motor Control
He has obtained MSEE degree with an emphasis on power electronics where he was worked on company sponsored academic research and development activities while pursuing graduate degree. He has been designing dc-link converters, full-wave rectifiers and ... See full profile

Massachusetts (MA), USA

Expert in Surface Mount Technology
Expert has been involved with surface-mount assembly for the past 18 years. He has extensive knowledge of solder paste printing, component placement, reflow and wave soldering, cleaning, inspection, and repair. See full profile

Tennessee (TN), USA

Expert in Semiconductor Industry IC Package Design and Development, Consulting and Training
Expert has over 20 years of experience in IC electronic packaging design, development, Signal Integrity Analysis, Material selection, package assembly, multichip modules, system in packaging, leadframe packages, BGAs, QFNs, leadless chip carriers Expert ... See full profile

California (CA), USA

Expert in Materials for Electronic Applications
Expert has successfully writen 2 proposals for EPA SBIR grants. The first was for a phase 1 program for the recovery and regeneration of spent etchants. This successful program was followed by a phase 2 proposal and award. That phase 2 program is in ... See full profile

California (CA), USA

Expert in Design for Test, Test Strategy, SMT Mfg, High-Speed Dig Design & PCB Layout, EMI/EMC, Digital Design
Expert has over thirty year's experience in the design, manufacturing, and test areas. His initial education was in Industrial Engineering (IE) and Business Administration. After receiving his BSEE/MSEE, where he majored in digital design, ... See full profile

Washington (WA), USA

Expert in Printed Wiring Board Assembly
Expert is the inventor of surface mount (SM) assembly. He has set up over 500 SM centers in the US, Europe, Australia, and Japan. He initiated SM at Motorola. Additionally, he has considerable experience auditing SM work centers so as to ... See full profile

Florida (FL), USA

Expert in Technical Marketing, New Product Development & Launch, Materials Physics
Heat transfer across interfaces and through particulate-filled composite materials (solids and liquids) was one of his primary areas of research while at 3M Company. His work included development of heat transfer products for use in electronic equipment ... See full profile

Minnesota (MN), USA

 
 

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