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Related Expert Areas


wafer bumping


physical process


bumped die


wafer rinse procedure


flip chip


tape-automated bonding


semiconductor wafer


Wafer Bumping Experts

The following experts are available as wafer bumping consultants and wafer bumping expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Wafer Bumping - The physical process in which isolated areas of a semiconductor wafer are provided with raised contacts, principally at bond pads.

Synonyms:  TAB bumping, tape-automated bonding bumping

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Expert in Semiconductor Wafer and Packaging Materials, Process, Equipment & Quality
Semiconductor Manufacturing Processes and Control Electronic Assembly and packaging Project / Program Management Metallurgical Engineering & ... See full profile

Arizona (AZ), USA

Expert in Adhesion Science, Surface Modification of Low Energy Polymers, Polar Bonding
His expertise in adhesive application comes as a result of identifying the correct adhesive for a particular joining requirement and the need to then be able to implement that solution in a production environment. He has over the years found a wide range ... See full profile

AB, Canada

Expert in Electronic Components: System Reliability, and Failure Analysis
Expert notes that active electronic elements such as transistors, diodes, integrated circuits, ASICs, MMICs, hybrid microelectronic devices, and MCMs are the basis for all electronic systems. Expert's depth of knowledge ... See full profile

Arizona (AZ), USA


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