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Related Expert Areas


wedge bonding


integrated-circuit manufacturing


integrated circuit assembly


lead frame


integrated circuit


Wedge Bonding Experts

The following experts are available as wedge bonding consultants and wedge bonding expert witnesses.  ORC experts are peer-recommended authorities who have been carefully selected and rigorously screened.
    Definition:  Wedge Bonding - Thermocompression bonding performed in integrated circuit fabrication. In wedge bonding, a wedge-shaped tool presses a small part of lead wire onto the bonding pad of an integrated circuit.

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Expert in Semiconductor Devices, Testing and Product Engineering, Marketing and Administration
Expert has spent most of his career in the semiconductor device and process technology areas. His experience is wide, with exposure to germanium and silicon discrete to large scale silicon integrated devices in the sub-micron regime. See full profile

California (CA), USA

Expert in Microelectronics Processing and Contamination Control, Cleanrooms, Particulates, Ultra High Purity
Expert has twenty years of research experience in semiconductor technology in major industrial laboratories. This, combined with his expertise gained by fifteen years managing microelectronics laboratories where he performed ... See full profile

New Mexico (NM), USA

Expert in Materials, Processes and Hermeticity Testing of Microelectronics for Aerospace and Medical Implants
He has demonstrated expertise in hermetic sealing and leak testing processes for cavity style packaged microcircuits intended for high reliability military, aerospace and Class III medical implants. He has worked as a hermeticity consultant for prominent ... See full profile

Pennsylvania (PA), USA


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